يعرض 1 - 10 نتائج من 108 نتيجة بحث عن '"J. Lacord"', وقت الاستعلام: 0.98s تنقيح النتائج
  1. 1
    Fabrication of Low-Power RRAM for Stateful Hyperdimensional Computing

    المؤلفون: T. Dubreuil, S. Barraud, B. Previtali, S. Martinie, J. Lacord, S. Martin, N. Castellani, A. Anotta, F. Andrieu

    المصدر: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT).

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4637ac4c0d97be7eca32e0b4275cfcf0
    https://doi.org/10.1109/vlsi-tsa/vlsi-dat57221.2023.10134182

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  2. 2
    3-Tier BSI CIS with 3D Sequential & Hybrid Bonding Enabling a1.4um pitch,106dB HDR Flicker Free Pixel

    المؤلفون: F. Guyader, P. Batude, P. Malinge, E. Vire, J. Lacord, J. Jourdon, J. Poulet, L. Gay, F. Ponthenier, S. Joblot, A. Farcy, L. Brunet, A. Albouy, C. Theodorou, M. Ribotta, D. Bosch, E. Ollier, D. Muller, M. Neyens, D. Jeanjean, T. Ferrotti, E. Mortini, J.G. Mattei, A. Inard, R. Fillon, F. Lalanne, F. Roy, E. Josse

    المصدر: 2022 International Electron Devices Meeting (IEDM).

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b8c8470b7f599580ca94cfd1cec41f23
    https://doi.org/10.1109/iedm45625.2022.10019432

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  3. 3
    Pragmatic OxRAM compact model ready to use for design studies

    المؤلفون: J. Lacord, C. Cagli, J. Sandrini

    المصدر: Solid-State Electronics. 204:108652

    مصطلحات موضوعية: Materials Chemistry, Electrical and Electronic Engineering, Condensed Matter Physics, Electronic, Optical and Magnetic Materials

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8d298bde4bf9c248626b94ed6c422e43
    https://doi.org/10.1016/j.sse.2023.108652

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  4. 4
    Methodology for Active Junction Profile Extraction in thin film FD-SOI Enabling performance driver identification in 500°C devices for 3D sequential integration

    المؤلفون: T. Mota Frutuoso, X. Garros, P. Batude, L. Brunet, J. Lacord, B. Sklenard, V. Lapras, C. Fenouillet-Beranger, M. Ribotta, A. Magalhaes-Lucas, J. Kanyandekwe, R. Kies, G. Romano, E. Catapano, M. Casse, J. Lugo-Alvarez, P. Ferrari, F. Gaillard

    المساهمون: Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA), Reliable RF and Mixed-signal Systems (TIMA-RMS), Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés (TIMA), Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes (UGA)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP ), Université Grenoble Alpes (UGA)-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes (UGA)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP ), Université Grenoble Alpes (UGA), IEEE

    المصدر: IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022)
    IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), Jun 2022, Honolulu (HI), United States. ⟨10.1109/VLSITechnologyandCir46769.2022.9830504⟩
    IEEELink

    مصطلحات موضوعية: resistance, silicon-on-insulator, three-dimensional displays, VLSI (Very Large Scale Integration), PACS 85.42, capacitance, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, predictive models, performance evaluation

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9eef2750dbb3aeee813a581581b63000
    https://hal.science/hal-04069091

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  5. 5
    A novel 3D 1T1R RRAM architecture for memory-centric Hyperdimensional Computing

    المؤلفون: T. Dubreuil, P. Amari, S. Barraud, J. Lacord, E. Esmanhotto, V. Meli, S. Martin, N. Castellani, B. Previtali, F. Andrieu

    المصدر: 2022 IEEE International Memory Workshop (IMW).

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8bc20a5a6b01e7dc49bb3466c5217728
    https://doi.org/10.1109/imw52921.2022.9779306

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  6. 6
    High-resistivity silicon-based substrate using buried PN junctions towards RFSOI applications

    المؤلفون: M. Moulin, M. Rack, T. Fache, Z. Chalupa, C. Plantier, Y. Morand, J. Lacord, F. Allibert, F. Gaillard, J. Lugo, L. Hutin, J.P. Raskin

    المساهمون: UCL - SST/ICTM/ELEN - Pôle en ingénierie électrique

    المصدر: Solid-State Electronics, Vol. 194, p. 108301 (2022)

    مصطلحات موضوعية: Materials Chemistry, Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Condensed Matter Physics, Electronic, Optical and Magnetic Materials

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0f20452394e65ae338243c621f85c2c0
    https://hdl.handle.net/2078.1/269243

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  7. 7
    3D sequential integration: applications and associated key enabling modules (design & technology)

    المؤلفون: P. Batude, O. Billoint, S. Thuries, P. Malinge, C. Fenouillet-Beranger, A. Peizerat, G. Sicard, P. Vivet, S. Reboh, C. Cavalcante, L. Brunet, M. Ribotta, L. Brevard, X. Garros, T. Mota Frutuoso, B. Sklenard, J. Lacord, J. Kanyandekwe, S. Kerdiles, P. Sideris, C. Theodorou, V. Lapras, M. Mouhdach, G. Gaudin, G. Besnard, I. Radu, F. Ponthenier, A. Farcy, E. Jesse, F. Guyader, T. Matheret, P. Brunet, F. Milesi, L. Le Van-Jodin, A. Sarrazin, B. Perrin, C. Moulin, S. Maitrejean, M. Alepidis, I. Ionica, S. Cristoloveanu, F. Gaillard, M. Vinet, F. Andrieu, J. Arcamone, E. Ollier

    المصدر: 2021 IEEE International Electron Devices Meeting (IEDM).

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a954addef7e27e3dfae349b36fd38937
    https://doi.org/10.1109/iedm19574.2021.9720671

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  8. 8
    Si/Si0.7Ge0.3 A2RAM nanowires fabrication and characterization for 1T-DRAM applications

    المؤلفون: J. Lacord, F. Tcheme Wakam, Z. Chalupa, J.-M. Hartmann, P. Besson, V. Loup, C. Vizioz, L. Brevard, F. Aussenac, X. Mescot, K. Lee, M. Bawedin

    المصدر: Solid-State Electronics. 193:108294

    مصطلحات موضوعية: Materials Chemistry, Electrical and Electronic Engineering, Condensed Matter Physics, Electronic, Optical and Magnetic Materials

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7e6d72453949fa662f5d50ac49cac541
    https://doi.org/10.1016/j.sse.2022.108294

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  9. 9
    Ultra-High-density 3D vertical RRAM with stacked JunctionLess nanowires for In-Memory-Computing applications

    المؤلفون: F. Andrieu, M. Ezzadeen, S. Barraud, J.-P. Noel, D. Bosch, Bastien Giraud, J. Lacord, J.-M. Portal, Didier Lattard

    المصدر: IEEE Transactions on Electron Devices

    مصطلحات موضوعية: 010302 applied physics, FOS: Computer and information sciences, business.industry, Computer science, Spice, Transistor, Electrical engineering, Nanowire, FOS: Physical sciences, Computer Science - Emerging Technologies, Integrated circuit, Applied Physics (physics.app-ph), Physics - Applied Physics, Operand, 01 natural sciences, Electronic, Optical and Magnetic Materials, law.invention, Resistive random-access memory, Non-volatile memory, Emerging Technologies (cs.ET), law, In-Memory Processing, 0103 physical sciences, Electrical and Electronic Engineering, business

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5e2d310202f806274e52ffb560f28948
    http://arxiv.org/abs/2012.00061

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  10. 10
    دورية أكاديمية

    لا يتم عرض هذه النتيجة على الضيوف.

    View record in Scopus
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