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المؤلفون: Hanako Okuno, T. Billon, J. F. Lugand, K. Yckache, S. Huet, L. Vandroux, Denis Mariolle, M. Fayolle, A. Fournier, J. Pontcharra, Viviane Muffato, P. Gautier, Jean Dijon, Etienne Quesnel, C. Jayet, H. Grampeix
المصدر: Microelectronic Engineering. 88:833-836
مصطلحات موضوعية: Materials science, Silicon, Copper interconnect, Polishing, chemistry.chemical_element, Nanotechnology, Carbon nanotube, Conductive atomic force microscopy, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, chemistry, law, Chemical-mechanical planarization, Wafer, Electrical measurements, Electrical and Electronic Engineering
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المؤلفون: H. Achard, L. Ulmer, F. Ducroquet, M.E. Nier, S. Tedesco, F. Coudert, T. Farjot, J.-F. Lugand, M. Heitzmann, Simon Deleonibus, Y. Gobil, Bernard Previtali
المصدر: IEEE Transactions on Electron Devices. 48:1816-1821
مصطلحات موضوعية: Materials science, Fabrication, business.industry, Transistor, Copper interconnect, Electrical engineering, chemistry.chemical_element, Hardware_PERFORMANCEANDRELIABILITY, Electronic, Optical and Magnetic Materials, law.invention, chemistry, law, Gate oxide, Chemical-mechanical planarization, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, Electrical and Electronic Engineering, Tin, Metal gate, business, AND gate, Hardware_LOGICDESIGN
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المؤلفون: P. Gautier, J. F. Lugand, Hanako Okuno, Jean Dijon, T. Billon, R. Kachtouli, M. Fayolle
المصدر: 2011 IEEE International Interconnect Technology Conference.
مصطلحات موضوعية: Materials science, Silicon, business.industry, Polishing, chemistry.chemical_element, Nanotechnology, Carbon nanotube, law.invention, chemistry, Resist, law, Chemical-mechanical planarization, Microelectronics, Wafer, business, Aluminum oxide
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::000283bf411124bd876857cffb633b2d
https://doi.org/10.1109/iitc.2011.5940269 -
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المؤلفون: R. Anciant, N. Sillon, N. Bresson, P. Brianceau, J. F. Lugand, G. Pares, S. Minoret, V. Lapras
المصدر: 2011 IEEE International Conference on IC Design & Technology.
مصطلحات موضوعية: Microelectromechanical systems, Wire bonding, Fabrication, Through-silicon via, chemistry, Computer science, Process (computing), Stacking, Electronic engineering, Deep reactive-ion etching, chemistry.chemical_element, Tungsten
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::24cb25a0ebeaaa7a5d4ad53b1500179d
https://doi.org/10.1109/icicdt.2011.5783204 -
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المؤلفون: G. Parès, N. Sillon, S. Huet, David Henry, S. Minoret, V. Lapras, Brendan Dunne, R. Anciant, J. F. Lugand
المصدر: 2009 11th Electronics Packaging Technology Conference.
مصطلحات موضوعية: Interconnection, Materials science, Through-silicon via, Silicon, chemistry, Chemical-mechanical planarization, Electronic engineering, chemistry.chemical_element, High voltage, Redistribution layer, Surface finish, Engineering physics, Leakage (electronics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b4aeea250200aef64e9ace862cb5db0d
https://doi.org/10.1109/eptc.2009.5416444 -
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المؤلفون: T. Farjot, F. Ducroquet, M.E. Nier, S. Tedesco, Bernard Previtali, Y. Gobil, M. Heitzmann, L. Ulmer, Simon Deleonibus, J.-F. Lugand, F. Coudert, H. Achard
المصدر: 30th European Solid-State Device Research Conference.
مصطلحات موضوعية: Materials science, Fabrication, business.industry, Copper interconnect, chemistry.chemical_element, Dielectric, law.invention, Capacitor, chemistry, law, Electronic engineering, Optoelectronics, Boron, Tin, business, Metal gate, Electronic circuit
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3070f749415614370b460bf23ced4f90
https://doi.org/10.1109/essderc.2000.194801 -
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المؤلفون: Francois Andrieu, A. Tiberj, B. Ghyselen, P. Leduc, J.M. Hartmann, Nicolas Daval, Y. Campidelli, Yves Morand, B. Blondeau, C. Lagahe-Blanchard, D. Bensahel, Vincent Paillard, J.-F. Lugand, Thomas Ernst, S. Pocas, Hubert Moriceau, Laetitia Vincent, O. Rayssac, Carlos Mazure, Cecile Aulnette, Alexandra Abbadie, Benedite Osternaud, A.-M. Cartier, Olivier Kermarrec, F. Fournel, N. Kernevez, I. Cayrefourq, Y. Bogumilowicz, M. Rivoire, C. Di Nardo, M.N. Séméria, Philippe Boucaud, Pascal Besson, Alain Claverie
المصدر: Scopus-Elsevier
مصطلحات موضوعية: Electron mobility, Materials science, business.industry, Optoelectronics, Silicon on insulator, Insulator (electricity), Strained silicon, Wafer, Thin film, business, Smart Cut
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ed859ed97c4c5b94b8b997344e406b10
http://www.scopus.com/inward/record.url?eid=2-s2.0-19944432923&partnerID=MN8TOARS -
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9دورية أكاديمية
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