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المؤلفون: Yunpeng Liu, Shimei Liu, Mingtao Lv, Taotao Chen, Junfu Liu, Hu He
المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
مصطلحات موضوعية: Stress (mechanics), Interconnection, Substrate (building), Materials science, business.industry, JEDEC memory standards, Soldering, Electronic packaging, Structural engineering, business, Drop test, Aspect ratio (image)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c1eb651abc3f87697a26e3428f101f75
https://doi.org/10.1109/icept52650.2021.9568091 -
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المؤلفون: Frank Döpper, Andreas Reinhardt, Konstantin Schmidt, Jörg Franke, Lukas Haas
المصدر: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
مصطلحات موضوعية: Reflow soldering, Explosive material, Moisture, business.industry, JEDEC memory standards, Simulation modeling, Delamination, Environmental science, Sensitivity (control systems), Diffusion (business), Process engineering, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9d7dea075c97f406db26430c36fbd844
https://doi.org/10.23919/empc53418.2021.9584942 -
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المؤلفون: Sunil Gupta
المصدر: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium.
مصطلحات موضوعية: Power demand, JEDEC memory standards, Hexagonal crystal system, Equalization (audio), Electronic engineering, Signal integrity, Voltage reference, Optimal weight, Mathematics, PCI Express
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8d45367f9751a67346f0d937e5bab08c
https://doi.org/10.1109/emc/si/pi/emceurope52599.2021.9559327 -
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المؤلفون: Pradeep Lall, Tony Thomas, Ken Blecker
المصدر: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
مصطلحات موضوعية: Computer science, JEDEC memory standards, Frequency domain, Acoustics, Feature vector, Principal component analysis, Prognostics, Natural frequency, Strain gauge, Shock (mechanics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::844e107e6a335ec46e0518003f135628
https://doi.org/10.1109/itherm51669.2021.9503297 -
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المؤلفون: Yang Chen, Na Mei, Tuobei Sun, Keqing Ouyang, Qiong Jin, Xiangming Fang
المصدر: 2021 China Semiconductor Technology International Conference (CSTIC).
مصطلحات موضوعية: Stress (mechanics), Reliability (semiconductor), Computer science, Residual stress, JEDEC memory standards, Hardware_INTEGRATEDCIRCUITS, Hardware_PERFORMANCEANDRELIABILITY, Temperature cycling, Chip, Automotive engineering, Die (integrated circuit), Voltage reference
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2aa4e07c402ea953083321debcc64709
https://doi.org/10.1109/cstic52283.2021.9461467 -
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المؤلفون: H. Yoon, Vinayak Bharat Naik, J. Kwon, K. Yamane, L. Pu, J. H. Lim, S. T. Woo, O. Kallensee, J. Hwang, Y. S. You, S. Ong, Jeff J. Xu, L. Zhang, Tae Young Lee, S. H. Jang, S. K L. C. Goh, F. Tan, Eng Huat Toh, D. Zeng, N. Balasankaran, Soh Yun Siah, Hemant Dixit, T. H. Chan, N. L. Chung, R. Low, G. Congedo, R. Chao, Y. Otani, Johannes Mueller, C.G. Lee, T. Merbeth, J. W. Ting, L. Y. Hau, K. W. Gan, Y. Huang, A. Vogel, E. Quek, C. Chiang, Behtash Behin-Aein, W. P. Neo, T. Ling, V. Kriegerstein, Chim Seng Seet, Jen Shuang Wong, B. Pfefferling
المصدر: 2020 IEEE International Electron Devices Meeting (IEDM).
مصطلحات موضوعية: 010302 applied physics, Magnetoresistive random-access memory, Computer science, business.industry, Automotive industry, Silicon on insulator, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Automotive engineering, Reliability (semiconductor), Stack (abstract data type), JEDEC memory standards, Soldering, 0103 physical sciences, Data retention, 0210 nano-technology, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2297be3b6e345d353ce3138acd58f0cd
https://doi.org/10.1109/iedm13553.2020.9371935 -
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المؤلفون: Fabio Andrade, Carlos Bernal, Manuel Jimenez
المصدر: ISCAS
مصطلحات موضوعية: Stress (mechanics), chemistry.chemical_compound, chemistry, Computer science, JEDEC memory standards, Logic gate, Range (statistics), Gallium nitride, Power semiconductor device, Test method, Simulation, Voltage
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::49948aa36752bb8e724635676d8d9d99
https://doi.org/10.1109/iscas45731.2020.9181147 -
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المؤلفون: Ke Pan, Seungbae Park, Junbo Yang, Chongyang Cai
المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
مصطلحات موضوعية: 010302 applied physics, Digital image correlation, business.industry, Computer science, Confocal, Measure (physics), Coplanarity, Deformation (meteorology), 01 natural sciences, Structured-light 3D scanner, 010309 optics, JEDEC memory standards, 0103 physical sciences, Calibration, Computer vision, Artificial intelligence, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b34f95ff6bf3e6a62806f499dbb6b42c
https://doi.org/10.1109/itherm45881.2020.9190235 -
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المؤلفون: Ken Blecker, Tony Thomas, Pradeep Lall
المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
مصطلحات موضوعية: Printed circuit board, Computer science, JEDEC memory standards, business.industry, Dimensionality reduction, Feature vector, Feature extraction, Structural engineering, business, Signal, Strain gauge, Shock (mechanics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::45b0dce9346fd7658bd7e215d306d2af
https://doi.org/10.1109/itherm45881.2020.9190946 -
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المؤلفون: Byeong Uk Hwang, Choong-Jae Lee, Kyung Deuk Min, Seung-Boo Jung, Hong-Sub Joo
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Interconnection, Materials science, Intermetallic, Electronic packaging, Solder paste, 02 engineering and technology, Surface finish, 021001 nanoscience & nanotechnology, 01 natural sciences, JEDEC memory standards, Soldering, 0103 physical sciences, Miniaturization, Composite material, 0210 nano-technology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fd57aeefdff0560864fdc71d3f8d618d
https://doi.org/10.1109/ectc32862.2020.00299