المؤلفون: Derakhshandeh, Jaber, Beyne, Eric, Beyer, Gerald, Capuz, Giovanni, Cherman, Vladimir, De Preter, Inge, Gerets, Carine, Shafahian, Ehsan, Kennes, Koen, Jamieson, Geraldine, Cochet, Tom, Webers, Tomas, Tobback, Bert, Van der Plas, Geert, La Tulipe, Douglas Charles, Phommahaxay, Alain, Miller, Andy

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1108-1113 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Derakhshandeh, Jaber, Gerets, Carine, Inoue, Fumihiro, Capuz, Giovanni, Cherman, Vladimir, Lofrano, Melina, Hou, Lin, Cochet, Tom, De Preter, Inge, Webers, Tomas, Bex, Pieter, Jamieson, Geraldine, Maehara, Masataka, Shafahian, Ehsan, Bertheau, Julien, Beyne, Eric, La Tulipe, Douglas Charles, Beyer, Gerald, Van der Plas, Geert, Miller, Andy

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1119-1124 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Derakhshandeh, Jaber, La Tulipe, Douglas Charles, Capuz, Giovanni, Cherman, Vladimir, Gerets, Carine, Cochet, Tom, Shafahian, Ehsan, Preter, Inge De, Jamieson, Geraldine, Webers, Tomas, Beyne, Eric, Beyer, Gerald, Miller, Andy

المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :131-132 May, 2022

Relation: 2022 International Conference on Electronics Packaging (ICEP)

المؤلفون: Van Huylenbroeck, Stefaan, De Vos, Joeri, El-Mekki, Zaid, Jamieson, Geraldine, Tutunjyan, Nina, Muga, Karthik, Stucchi, Michele, Miller, Andy, Beyer, Gerald, Beyne, Eric

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1035-1040 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

المؤلفون: De Vos, Joeri, Van Huylenbroeck, Stefaan, Jourdain, Anne, Heylen, Nancy, Peng, Lan, Jamieson, Geraldine, Tutunjyan, Nina, Sardo, Stefano, Miller, Andy, Beyne, Eric

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :1499-1504 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

المؤلفون: Derakhshandeh, Jaber, Hou, Lin, De Preter, Inge, Gerets, Carine, Suhard, Samuel, Dubey, Vikas, Jamieson, Geraldine, Inoue, Fumihiro, Webers, Tomas, Bex, Pieter, Capuz, Giovanni, Beyne, Eric, Slabbekoorn, John, Wang, Teng, Jourdain, Anne, Beyer, Gerald, June Rebibis, Kenneth, Miller, Andy

المصدر: 2016 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2016 IEEE International. :1-4 Nov, 2016

Relation: 2016 IEEE International 3D Systems Integration Conference (3DIC)

المؤلفون: Van Huylenbroeck, Stefaan, Li, Yunlong, De Vos, Joeri, Jamieson, Geraldine, Tutunjyan, Nina, Miller, Andy, Beyer, Gerald, Beyne, Eric

المصدر: 2018 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2018 IEEE International. :94-96 Jun, 2018

Relation: 2018 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Gupta, Anshul, Kundu, Shreya, Teugels, Lieve, Bommels, Jurgen, Adelmann, Christoph, Heylen, Nancy, Jamieson, Geraldine, Pedreira, Olalla Varela, Ciofi, Ivan, Chava, Bharani, Wilson, Christopher J., Tokei, Zsolt

المصدر: 2018 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2018 IEEE International. :4-6 Jun, 2018

Relation: 2018 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Dutta, Shibesh, Kundu, Shreya, Wen, Lianggong, Jamieson, Geraldine, Croes, Kristof, Gupta, Anshul, Bommels, Jurgen, Wilson, Christopher J., Adelmann, Christoph, Tokei, Zsolt

المصدر: 2017 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2017 IEEE International. :1-3 May, 2017

Relation: 2017 IEEE International Interconnect Technology Conference (IITC)

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