المؤلفون: Han, Seong-ju, Park, Gun-woo, Jang, Keon-Soo

المصدر: In Microelectronics Reliability August 2024 159

المؤلفون: Choi, Gyoung Su, Jang, Keon-Soo

المصدر: In International Journal of Adhesion and Adhesives March 2024 130

المؤلفون: Choi, Kwang-Seong, Braganca Junior, Wagno Alves, Jeong, leeseul, Jang, Keon-Soo, Moon, Seok Hwan, Bae, Hyun-Cheol, Eom, Yong-Sung, Cho, Min Kyo, Chang, Seung Il

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :1567-1573 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

المؤلفون: Alves Braganca, Wagno, Eom, Yong-Sung, Son, Jihye, Jang, Keon-Soo, Bae, Hyun-Cheol, Moon, Seok Hwan, Choi, Kwang-Seong

المصدر: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-8 Dec, 2017

Relation: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Eom, Yong-Sung, Jang, Keon-Soo, Son, Ji-Hye, Bae, Hyun-Cheol, Choi, Kwang-Seong

المصدر: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European. :1-4 Sep, 2017

Relation: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition

المؤلفون: Jang, Keon-Soo, Eom, Yong-Sung, Choi, Kwang-Seong, Bae, Hyun-Cheol

المصدر: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European. :1-4 Sep, 2017

Relation: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition

المؤلفون: Yoon, Sang-Seok, Lee, Sung-Hun, Hwang, Gyu-Chul, Choi, Min-Kyu, Kang, Beom-Goo, Kim, Hyungsu, Jang, Keon-Soo^{Aff1, IDs1323302200455_cor7}

المصدر: Macromolecular Research. 30(6):365-374

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المؤلفون: Jang, Keon-Soo, Yeom, Hyo Yeol, Park, Ju Won, Lee, Song Hee, Lee, Seong Jae^{Aff1, IDs1336702100287_cor5}

المصدر: Korea-Australia Rheology Journal. 33(4):357-366

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