المؤلفون: Lee, T. Y., Yamane, K., Hau, L. Y., Chao, R., Chung, N. L., Naik, V. B., Sivabalan, K., Kwon, J., Lim, J. H., Neo, W. P., Khua, K., Thiyagarajah, N., Jang, S. H., Behin-Aein, B., Toh, E. H., Otani, Y., Zeng, D., Balasankaran, N., Goh, L. C., Ling, T., Hwang, J., Zhang, L., Low, R., Tan, S. L, Seet, C. S., Ting, J. W., Ong, S., You, Y. S., Woo, S. T., Quek, E., Siah, S. Y.

المصدر: 2020 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2020 IEEE International. :1-4 Apr, 2020

Relation: 2020 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Naik, V. B., Yamane, K., Kwon, J., K, S., Lim, J. H., Ali, Z., Behin-Aein, B., Chung, N. L., Hau, L. Y., Chao, R., Chiang, C., Huang, Y., Pu, L., Otani, Y., Dixit, H., Jang, S. H., Balasankaran, N., Tan, F., Neo, W. P., Goh, L. C., Toh, E. H., Ling, T., Ting, J. W., Yoon, H., Congedo, G., Mueller, J., Pfefferling, B., Kallensee, O., Vogel, A., Merbeth, T., Seet, C. S., Wong, J., Bordelon, J., You, Y. S., Soss, S., Chan, T. H., Quek, E., Siah, S. Y.

المصدر: 2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021

Relation: 2021 Symposium on VLSI Technology

المؤلفون: Motome, Y., Sano, R., Jang, S. -H., Sugita, Y., Kato, Y.

المصدر: J. Phys.: Condens. Matter 32, 404001 (2020)

مصطلحات موضوعية: Condensed Matter - Strongly Correlated Electrons

URL الوصول: http://arxiv.org/abs/2001.03731

المؤلفون: Lee, T. Y., Yamane, K., Kwon, J., Naik, V. B., Otani, Y., Zeng, D., Lim, J. H., Sivabalan, K., Chiang, C., Huang, Y., Jang, S. H., Hau, L. Y., Chao, R., Chung, N. L., Neo, W. P., Khua, K., Thiyagarajah, N., Ling, T., Goh, L. C., Hwang, J., Zhang, L., Low, R., Balasankaran, N., Tan, F., Wong, J., Seet, C. S., Ting, J. W., Ong, S., You, Y. S., Woo, S. T., Siah, S. Y.

المصدر: 2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020

Relation: 2020 IEEE Symposium on VLSI Technology

المؤلفون: Lee, T. Y., Yamane, K., Otani, Y., Zeng, D., Kwon, J., Lim, J. H., Naik, V. B., Hau, L. Y., Chao, R., Chung, N. L., Ling, T., Jang, S. H., Goh, L. C., Hwang, J., Zhang, L., Low, R., Balasankaran, N., Tan, F., Ting, J. W., Chang, J., Seet, C. S., Ong, S., You, Y. S., Woo, S. T., Chan, T. H., Siah, S. Y.

المصدر: 2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :11.6.1-11.6.4 Dec, 2020

Relation: 2020 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Naik, V. B., Lee, K., Yamane, K., Chao, R., Kwon, J., Thiyagarajah, N., Chung, N. L., Jang, S. H., Behin-Aein, B., Lim, J. H., Lee, T. Y., Neo, W. P., Dixit, H., K, S., Goh, L. C., Ling, T., Hwang, J., Zeng, D., Ting, J. W., Toh, E. H., Zhang, L., Low, R., Balasankaran, N., Zhang, L. Y., Gan, K. W., Hau, L. Y., Mueller, J., Pfefferling, B., Kallensee, O., Tan, S. L., Seet, C. S., You, Y. S., Woo, S. T., Quek, E., Siah, S. Y., Pellerin, J.

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :2.3.1-2.3.4 Dec, 2019

Relation: 2019 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Park, B. H., Jang, S. H., Kim, C. H., Jung, J. H.

المصدر: 2015 Asia-Pacific Microwave Conference (APMC) Microwave Conference (APMC), 2015 Asia-Pacific. 3:1-3 Dec, 2015

Relation: 2015 Asia-Pacific Microwave Conference (APMC)

المؤلفون: Lee, K., Yamane, K., Noh, S., Naik, V. B., Yang, H., Jang, S. H., Kwon, J., Behin-Aein, B., Chao, R., Lim, J. H., S. K., Gan, K. W., Zeng, D., Thiyagarajah, N., Goh, L. C., Liu, B., Toh, E. H., Jung, B., Wee, T. L., Ling, T., Chan, T. H., Chung, N. L., Ting, J. W., Lakshmipathi, S., Son, J. S., Hwang, J., Zhang, L., Low, R., Krishnan, R., Kitamura, T., You, Y. S., Seet, C. S., Cong, H., Shum, D., Wong, J., Woo, S. T., Lam, J., Quek, E., See, A., Siah, S. Y.

المصدر: 2018 IEEE Symposium on VLSI Technology VLSI Technology, 2018 IEEE Symposium on. :183-184 Jun, 2018

Relation: 2018 IEEE Symposium on VLSI Technology

المؤلفون: Lee, K., Chao, R., Yamane, K., Naik, V. B., Yang, H., Kwon, J., Chung, N. L., Jang, S. H., Behin-Aein, B., Lim, J.H., K, S., Liu, B., Toh, E. H., Gan, K. W., Zeng, D., Thiyagarajah, N., Goh, L. C., Ling, T., Ting, J. W., Hwang, J., Zhang, L., Low, R., Krishnan, R., Tan, S. L, You, Y. S., Seet, C. S., Cong, H., Wong, J., Woo, S. T., Quek, E., Siah, S. Y.

المصدر: 2018 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2018 IEEE International. :27.1.1-27.1.4 Dec, 2018

Relation: 2018 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Lin, C. H., Cheng, B., Tsai, M. L., Fu, H. C., Luo, W., Zhou, L. H., Jang, S. H., Hu, L. B., He, J. H.

المصدر: 2017 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2017 IEEE International. :8.5.1-8.5.4 Dec, 2017

Relation: 2017 IEEE International Electron Devices Meeting (IEDM)