المؤلفون: Jang, S.H., Kim, T.W.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(9):4909-4913 Sep, 2022

المؤلفون: Naik, V. B., Yamane, K., Kwon, J., Lim, J.H., Balasankaran, N., Chung, N.L., Hau, L.Y., Chao, R., Chiang, C., Huang, Y., Pu, L., Ma, L., Meng, C., Otani, Y., Zhang, L., Jang, S.H., Ling, T., Ting, J.W., Yoon, H., Mueller, J., Pfefferling, B., Kallensee, O., Merbeth, T., Seet, C.S., Wong, J., You, Y.S., Soss, S., Chan, T.H., Siah, S.Y.

المصدر: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2022 6th IEEE. :366-368 Mar, 2022

Relation: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

المؤلفون: Kang, M.J., Kim, M.S., Jang, S.H., Fobelets, K.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 68(8):4156-4160 Aug, 2021

المؤلفون: Naik, V. B., Lim, J. H., Yamane, K., Kwon, J., B., Behin-Aein, Chung, N. L., K, S., Hau, L. Y., Chao, R., Chiang, C., Huang, Y., Pu, L., Otani, Y., Jang, S.H., Balasankaran, N., Neo, W. P., Ling, T., Ting, J. W., Yoon, H., Mueller, J., Pfefferling, B., Kallensee, O., Merbeth, T., Seet, C.S., Wong, J., You, Y. S., Soss, S., Chan, T. H., Siah, S. Y.

المصدر: 2022 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2022 IEEE International. :6B.3-1-6B.3-6 Mar, 2022

Relation: 2022 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Naik, V.B., Yamane, K., Lim, J.H., Lee, T.Y., Kwon, J., Aein, B., Chung, N.L., Hau, L.Y., Chao, R., Zeng, D., Otani, Y., Chiang, C., Huang, Y., Pu, L., Thiyagarajah, N., Jang, S.H., Neo, W.P., Dixit, H., Aris, S.K., Goh, L.C., Ling, T., Hwang, J., Ting, J.W., Zhang, L., Low, R., Balasankaran, N., Seet, C.S., Ong, S., Wong, J., You, Y.S., Woo, S.T., Siah, S.Y.

المصدر: 2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020

Relation: 2020 IEEE Symposium on VLSI Technology

المؤلفون: Naik, V. B., Yamane, K., Lee, T.Y., Kwon, J., Chao, R., Lim, J.H., Chung, N.L., Behin-Aein, B., Hau, L.Y., Zeng, D., Otani, Y., Chiang, C., Huang, Y., Pu, L., Jang, S.H., Neo, W.P., Dixit, H., Goh, S. K L. C., Toh, E. H., Ling, T., Hwang, J., Ting, J.W., Low, R., Zhang, L., Lee, C.G., Balasankaran, N., Tan, F., Gan, K. W., Yoon, H., Congedo, G., Mueller, J., Pfefferling, B., Kallensee, O., Vogel, A., Kriegerstein, V., Merbeth, T., Seet, C.S., Ong, S., Xu, J., Wong, J., You, Y.S., Woo, S.T., Chan, T.H., Quek, E., Siah, S. Y.

المصدر: 2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :11.3.1-11.3.4 Dec, 2020

Relation: 2020 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Jun Hyung Lim, Jung Ho Kim, Jang, S.H., Kyu Tae Kim, Jin Sung Lee, Jinho Joo, Chan-Joong Kim, Hong-Soo Ha, Chan Park

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 15(2):2675-2678 Jun, 2005

المؤلفون: Kyu Tae Kim, Jun Hyung Lim, Jung Ho Kim, Jang, S.H., Jinho Joo, Chan-Joong Kim, Kyu Jeong Song, Hyung Sub Shin

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 15(2):2683-2686 Jun, 2005

المؤلفون: Jang, S.H., Jun Hyung Lim, Jung Ho Kim, Bong Ki Ji, Jinho Joo, Nah, W., Volf, J.S., Hua Kun Liu, Apperley, M.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 13(2):2956-2959 Jun, 2003

المؤلفون: Jung Ho Kim, Kyu Tae Kim, Jang, S.H., Jinho Joo, Seyong Choi, Nah, W., Kang, H., Tae Kuk Ko, Hong-Soo Ha, Sang-Soo Oh, Kang-Sik Ryu, Nash, P.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 13(2):2992-2995 Jun, 2003