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1
المؤلفون: Tsung-Wei Lin, Hung-Yu Lin, Mang-Shiun Chiang, Yeh Shi-Cheng, Jason Sweis, Philippe Hurat, Tung Yu Wu, Chun-Sheng Wu, Chao-Yi Huang, Ya-Chieh Lai
المصدر: DTCO and Computational Patterning II.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::63a2390794795528d4dc69cce2eed1be
https://doi.org/10.1117/12.2657649 -
2
المؤلفون: Tsung-Wei Lin, Chun Yen Liu, Hung-Yu Lin, Mang-Shiun Chiang, Jason Sweis, Chun Yen Liao, Chun-Sheng Wu, Chao-Yi Huang, Ya-Chieh Lai, Philippe Hurat
المصدر: DTCO and Computational Patterning.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::dcb1952ea6978b9902e3b9fa2e0eac71
https://doi.org/10.1117/12.2612476 -
3
المؤلفون: Nur Ameera Ameelia Binti Iskandar Zulkarnain, Jason Sweis, Ezni Aznida Binti Kamal Baharin, Mohamad Fahmi Bin Muhsain, Muhamad Asraf Bin Ahmad Ibrahim, Muhamad Faiz Bin Abd Malek
المصدر: DTCO and Computational Patterning.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::44661f5140dea713e7c5a600ccff42dc
https://doi.org/10.1117/12.2606175 -
4
المؤلفون: Hungyu Lin, Ethan Wang, Jason Sweis, Philippe Hurat, Ya-Chieh Lai, Pai Yu-Chin, Ku Fang, Ching Juan Lee, Chia Wei Huang, Jun-Ming Chen, Yung-Feng Cheng
المصدر: Metrology, Inspection, and Process Control XXXVI.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::83612338b32e5cfd4ec4088e975113a9
https://doi.org/10.1117/12.2613620 -
5
المؤلفون: Jason Sweis, Piyush Pathak, Moutaz Fakhry, Jason P. Cain, Frank E. Gennari, Ya-Chieh Lai
المصدر: Design-Process-Technology Co-optimization for Manufacturability XII.
مصطلحات موضوعية: Framingham Risk Score, Process (engineering), Computer science, business.industry, Rank (computer programming), Pattern analysis, Integrated circuit, Machine learning, computer.software_genre, Pattern selection, law.invention, law, Pattern matching, Artificial intelligence, Physical design, business, computer
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::57cf9c5710c64943318d5850a99f8c56
https://doi.org/10.1117/12.2299492 -
6
المؤلفون: Muhamad Asraf Bin Ahmad Ibrahim, Philippe Hurat, Ezni Aznida Binti Kamal Baharin, Ya-Chieh Lai, Mohamad Fahmi Bin Muhsain, Jason Sweis
المصدر: Design-Process-Technology Co-optimization for Manufacturability XII.
مصطلحات موضوعية: Computer science, business.industry, Embedded system, Next-generation network, Hardware_INTEGRATEDCIRCUITS, Block detection, Pattern analysis, Process window, Design cycle, Tape-out, business, Turnaround time
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::51bb7fba970a0cd3ed8d0c0e125b9b3c
https://doi.org/10.1117/12.2297675 -
7
المؤلفون: Paul Lupa, Ruoping Wang, Jason Sweis, Ya-Chieh Lai, Philippe Hurat
المصدر: Design-Process-Technology Co-optimization for Manufacturability XII.
مصطلحات موضوعية: Matching (statistics), Computer science, Hardware_INTEGRATEDCIRCUITS, Pattern analysis, Mask inspection, Data mining, Pattern matching, Cadence, computer.software_genre, Fuzzy logic, computer
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3b1692b8ad84fed72dc06c5c0dd2c57e
https://doi.org/10.1117/12.2297097 -
8
المؤلفون: Jason Sweis, Jason P. Cain, Piyush Pathak, Moutaz Fakhry, Frank E. Gennari, Ya-Chieh Lai
المصدر: SPIE Proceedings.
مصطلحات موضوعية: business.industry, Computer science, 02 engineering and technology, 021001 nanoscience & nanotechnology, computer.software_genre, Track (rail transport), 01 natural sciences, 010309 optics, Work (electrical), Analytics, Yield risk, 0103 physical sciences, Structural pattern, Data mining, Physical design, 0210 nano-technology, business, computer
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ba8a5323293bec9c2b0b1020f6f313b4
https://doi.org/10.1117/12.2262363 -
9
المؤلفون: Thomas Yang, Yang Shen, Yifan Zhang, Ya-Chieh Lai, Jason Sweis
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Set (abstract data type), Yield (engineering), Silicon, chemistry, Computer science, Process (computing), chemistry.chemical_element, Wafer, Characterization (materials science), Reliability engineering, Block (data storage)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::01610cc6d54fe64ffe4c20323d22cf94
https://doi.org/10.1117/12.2259950 -
10
المؤلفون: Jason Sweis, Ya-Chieh Lai, Yifan Zhang, MengFeng Cai, Linda Zhuang, Annie Zhu
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Computer science, visual_art, Real-time computing, Electronic component, visual_art.visual_art_medium, Profiling (information science), Reliability engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4d2bee0d03e4577247e8e32ba4897dc4
https://doi.org/10.1117/12.2260311