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1مؤتمر
المؤلفون: Li, K. C., Ku, J.L., Lee, Andrew, Jay CY Huang
المصدر: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International. :493-496 Oct, 2009
Relation: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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2
المؤلفون: Jimmy Yang, Cheng Yu Chen, Jay Cy Huang, Jojo Tsai, Vincent Lee, J. L. Ku, Ander Hsieh, K. C. Li
المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
مصطلحات موضوعية: Surface-mount technology, Materials science, Stencil printing, Aperture, Laser cutting, Soldering, Ball grid array, Metallurgy, Solder paste, Composite material, Stencil
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::923b2af3d7b1a2df4be4452468325cab
https://doi.org/10.1109/impact.2010.5699642 -
3
المؤلفون: K. C. Li, Mike Huang, Jay Cy Huang, Jimmy Yang, Ander Hsieh, J. L. Ku
المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
مصطلحات موضوعية: Materials science, Optical microscope, Scanning electron microscope, law, Soldering, Metallurgy, Fracture (geology), Surface finish, Microstructure, Joint (geology), Surface finishing, law.invention
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::441d73a2946400dc3640d2a2f8505853
https://doi.org/10.1109/impact.2010.5699643 -
4
المؤلفون: Jay Cy Huang, Jimmy Yang, J. L. Ku, K. C. Li, Andrew Lee
المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
مصطلحات موضوعية: Printed circuit board, Substrate (building), Engineering, business.industry, Soldering, Package on package, Integrated circuit packaging, Temperature cycling, Composite material, business, Joint (geology), Weibull distribution, Reliability engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::736673c82c072867ba8fc2f29fde55db
https://doi.org/10.1109/impact.2010.5699641 -
5
المؤلفون: K.C. Li, J.L. Ku, S. Lee, Jay Cy Huang
المصدر: 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.
مصطلحات موضوعية: Materials science, Alloy, Metallurgy, chemistry.chemical_element, engineering.material, Solderability, Copper, Corrosion, Printed circuit board, chemistry, Soldering, engineering, Wave soldering, Surface finishing
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a86b5e48288ea71ebf012c08f2101a09
https://doi.org/10.1109/impact.2008.4783821