المؤلفون: Li, K. C., Ku, J.L., Lee, Andrew, Jay CY Huang

المصدر: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International. :493-496 Oct, 2009

Relation: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Jimmy Yang, Cheng Yu Chen, Jay Cy Huang, Jojo Tsai, Vincent Lee, J. L. Ku, Ander Hsieh, K. C. Li

المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

مصطلحات موضوعية: Surface-mount technology, Materials science, Stencil printing, Aperture, Laser cutting, Soldering, Ball grid array, Metallurgy, Solder paste, Composite material, Stencil

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::923b2af3d7b1a2df4be4452468325cab
https://doi.org/10.1109/impact.2010.5699642

المؤلفون: K. C. Li, Mike Huang, Jay Cy Huang, Jimmy Yang, Ander Hsieh, J. L. Ku

المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

مصطلحات موضوعية: Materials science, Optical microscope, Scanning electron microscope, law, Soldering, Metallurgy, Fracture (geology), Surface finish, Microstructure, Joint (geology), Surface finishing, law.invention

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::441d73a2946400dc3640d2a2f8505853
https://doi.org/10.1109/impact.2010.5699643

المؤلفون: Jay Cy Huang, Jimmy Yang, J. L. Ku, K. C. Li, Andrew Lee

المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

مصطلحات موضوعية: Printed circuit board, Substrate (building), Engineering, business.industry, Soldering, Package on package, Integrated circuit packaging, Temperature cycling, Composite material, business, Joint (geology), Weibull distribution, Reliability engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::736673c82c072867ba8fc2f29fde55db
https://doi.org/10.1109/impact.2010.5699641

المؤلفون: K.C. Li, J.L. Ku, S. Lee, Jay Cy Huang

المصدر: 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.

مصطلحات موضوعية: Materials science, Alloy, Metallurgy, chemistry.chemical_element, engineering.material, Solderability, Copper, Corrosion, Printed circuit board, chemistry, Soldering, engineering, Wave soldering, Surface finishing

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a86b5e48288ea71ebf012c08f2101a09
https://doi.org/10.1109/impact.2008.4783821