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1
المؤلفون: Changhong Wu, Wei-Tsu Tseng, Tim McCormack, Ji Chul Yang
المصدر: ECS Journal of Solid State Science and Technology. 6:P718-P722
مصطلحات موضوعية: 010302 applied physics, Materials science, Metallurgy, Abrasive, Oxide, 02 engineering and technology, Nitride, 021001 nanoscience & nanotechnology, 01 natural sciences, Electronic, Optical and Magnetic Materials, chemistry.chemical_compound, chemistry, Shallow trench isolation, 0103 physical sciences, Slurry, Wafer, 0210 nano-technology
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2
المؤلفون: Tai Fong Chao, Dinesh K. Penigalapati, Dinesh Koli, Amarnath Jha, Ji Chul Yang
المصدر: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
مصطلحات موضوعية: Leading edge, Yield (engineering), Materials science, business.industry, 02 engineering and technology, 021001 nanoscience & nanotechnology, 020303 mechanical engineering & transports, 0203 mechanical engineering, CMOS, Scientific method, Electronic engineering, Optoelectronics, Particle, 0210 nano-technology, business, Sol-gel
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::102fdeddf2ba2d4f8a64cef2e4f623d4
https://doi.org/10.1109/asmc.2017.7969253 -
3
المؤلفون: Jaihyung Won, Taesung Kim, Ji Chul Yang, Chilgee Lee, Hojoong Kim, Dong Won Oh
المصدر: Journal of Electronic Materials. 42:97-102
مصطلحات موضوعية: Materials science, Metallurgy, Abrasive, Polishing, Condensed Matter Physics, Debris, Conditioning process, Electronic, Optical and Magnetic Materials, Scratch, Chemical-mechanical planarization, Materials Chemistry, Wafer, Electrical and Electronic Engineering, computer, computer.programming_language
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4
المؤلفون: Taesung Kim, Hoomi Choi, Jaung-Joo Kim, Ji Chul Yang, Sang Won Lee, M.S. Oh, Soo-Chul Lee, Jinsung Kim
المصدر: Thin Solid Films. 521:201-205
مصطلحات موضوعية: Materials science, Silicon, Whiskers, Metals and Alloys, chemistry.chemical_element, Dichlorosilane, Nanotechnology, Surfaces and Interfaces, Nitride, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, chemistry.chemical_compound, chemistry, Whisker, law, Materials Chemistry, Deposition (phase transition), Wafer, Composite material, Susceptor
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5
المؤلفون: Sung Ha Park, Hojoong Kim, Jehyung Won, Taesung Kim, Mingu Kim, Junwye Lee, Ji Chul Yang
المصدر: ECS Journal of Solid State Science and Technology. 1:P101-P106
مصطلحات موضوعية: chemistry.chemical_compound, Materials science, Adsorption, chemistry, Chemical-mechanical planarization, Oxide, Slurry, Polishing, Wafer, Surface finish, Lubricant, Composite material, Electronic, Optical and Magnetic Materials
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6
المؤلفون: Chilgee Lee, Taewook Hwang, Taesung Kim, Joo Hoon Choi, Ji Chul Yang
المصدر: International Journal of Machine Tools and Manufacture. 50:860-868
مصطلحات موضوعية: Engineering drawing, Materials science, Mechanical Engineering, Diamond, Surface finish, engineering.material, Industrial and Manufacturing Engineering, Tetraethyl orthosilicate, chemistry.chemical_compound, chemistry, Chemical-mechanical planarization, engineering, Wafer, Composite material, Contact area, Porosity, Fumed silica
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7Step height removal mechanism of chemical mechanical planarization (CMP) for sub-nano-surface finish
المؤلفون: Gae Won Lee, Dong Won Oh, Taesung Kim, Ji Chul Yang, Chang Lyung Song
المصدر: Wear. 268:505-510
مصطلحات موضوعية: Materials science, Colloidal silica, Abrasive, Metallurgy, technology, industry, and agriculture, Polishing, Surfaces and Interfaces, Surface finish, Tribology, Edge (geometry), Condensed Matter Physics, Surfaces, Coatings and Films, Mechanics of Materials, Chemical-mechanical planarization, Materials Chemistry, Composite material, Fumed silica
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8
المؤلفون: Hojoong Kim, Taesung Kim, Dong Won Oh, Ji Chul Yang
المصدر: Journal of Electronic Materials. 39:338-346
مصطلحات موضوعية: Thermogravimetric analysis, Materials science, Diamond, Polishing, Tribology, engineering.material, Condensed Matter Physics, Electronic, Optical and Magnetic Materials, Chemical-mechanical planarization, Materials Chemistry, Hardening (metallurgy), engineering, Wafer, Electrical and Electronic Engineering, Composite material, Elastic modulus
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9
المؤلفون: Ji Chul Yang, Daniel Scheffler, Yong Sik Moon
المصدر: Proceedings of International Conference on Planarization/CMP Technology 2014.
مصطلحات موضوعية: Engineering drawing, Engineering, Consumables, business.industry, Process (computing), Mechanical engineering, Polishing, Tribology, Reliability (semiconductor), Scratch, Chemical-mechanical planarization, Wafer, business, computer, computer.programming_language
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::08be1b3bef8efcc36542921a8cb0965b
https://doi.org/10.1109/icpt.2014.7017268 -
10
المؤلفون: Dae Eun Kim, Bo-Sung Shin, Ji Chul Yang, In-Ha Sung
المصدر: Wear. 255:808-818
مصطلحات موضوعية: Materials science, Silicon, chemistry.chemical_element, Nanotechnology, Self-assembled monolayer, Surfaces and Interfaces, Condensed Matter Physics, Octadecyltrichlorosilane, Isotropic etching, Surface energy, Surfaces, Coatings and Films, chemistry.chemical_compound, chemistry, Resist, Chemical engineering, Mechanics of Materials, Monolayer, Nano, Materials Chemistry