المؤلفون: Jia Yu-bin, Hao Yi-long, Zhang Rong

المصدر: Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004. Solid-state and integrated circuits technology Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on. 3:1812-1815 vol.3 2004

Relation: 2004 7th International Conference on Solid-State and Integrated Circuits Technology Proceedings

المؤلفون: He, Jia-Wei, Chung, Smart, Liao, Peter, Zheng, Hui-Long, Su, Zi-Fang, Zhang, Xiang, Jia, Yu-Bin

المصدر: SID Symposium Digest of Technical Papers; Oct2022 Supplement S1, Vol. 53, p781-784, 4p

مصطلحات موضوعية: ELECTRICAL resistivity, ELECTRODIFFUSION, ALUMINUM, COPPER, INDIUM gallium zinc oxide, COPPER films, PIXELS

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المؤلفون: Hao Yilong, Zhang Rong, Jia Yu-bin

المصدر: Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004..

مصطلحات موضوعية: Engineering, business.industry, Acoustics, Electrical engineering, Natural frequency, Sense (electronics), Accelerometer, law.invention, Vibration, Acceleration, law, Fictitious force, Proof mass, Tuning fork, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4df0cf915f815b0511cdfae07a54da9e
https://doi.org/10.1109/icsict.2004.1435186

المؤلفون: Huang, Qin Wen, Li, Xiang Guang, Wang, Yun Hui, Jia, Yu Bin

المصدر: Applied Mechanics and Materials; February 2014, Vol. 511 Issue: 1 p732-736, 5p

المؤلفون: Li, Xiang Guang, Huang, Qin Wen, Wang, Yun Hui, Jia, Yu Bin, Wang, Zhi Bin

المصدر: Applied Mechanics and Materials; September 2013, Vol. 427 Issue: 1 p120-123, 4p

المؤلفون: Jia, Yu Bin, Wang, Shi Tao, Huang, Qin Wen, Hao, Yi Long

المصدر: Advanced Materials Research; May 2013, Vol. 694 Issue: 1 p1030-1033, 4p

المؤلفون: Jia, Yu Bin

المصدر: Advanced Materials Research; May 2013, Vol. 690 Issue: 1 p1698-1701, 4p

المؤلفون: Jia, Yu Bin, Huang, Qing Wen

المصدر: Advanced Materials Research; January 2013, Vol. 655 Issue: 1 p790-794, 5p

المؤلفون: Jia, Yu Bin

المصدر: Advanced Materials Research; January 2013, Vol. 645 Issue: 1 p373-376, 4p