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1دورية أكاديمية
المؤلفون: Yang, Y.J., Cheng, B.Y., Jin, Z.S., Gao, H.X., Ma, M.Z., Zhang, X.Y.
المصدر: In Journal of Alloys and Compounds 5 March 2020 816
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2دورية أكاديمية
المؤلفون: Jin, Z.S., Yang, Y.J., Zhang, Z.P., Ma, X.Z., Lv, J.W., Wang, F.L., Ma, M.Z., Zhang, X.Y., Liu, R.P.
المصدر: In Journal of Alloys and Compounds 25 October 2019 806:668-675
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3مؤتمر
المؤلفون: Li, J.J., Gu, C.Z., Peng, H.Y., Wu, H.H., Jin, Z.S.
المصدر: IVESC 2004. The 5th International Vacuum Electron Sources Conference Proceedings (IEEE Cat. No.04EX839) Vacuum electron sources Vacuum Electron Sources Conference, 2004. Proceedings. IVESC 2004. The 5th International. :253-255 2004
Relation: IVESC 2004. The 5th International Vacuum Electron Sources Conference Proceedings
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4دورية أكاديمية
المؤلفون: Yang, Y.J., Zhang, Z.P., Jin, Z.S., Sun, W.C., Xia, C.Q., Ma, M.Z., Zhang, X.Y., Li, G., Liu, R.P.
المصدر: In Journal of Alloys and Compounds 25 April 2019 782:927-935
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5دورية أكاديمية
المؤلفون: Yang, Y.J., Jin, Z.S., Ma, X.Z., Zhang, Z.P., Zhong, H., Ma, M.Z., Zhang, X.Y., Li, G., Liu, R.P.
المصدر: In Journal of Alloys and Compounds 25 June 2018 750:757-764
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6مؤتمر
المصدر: Eleventh International Vacuum Microelectronics Conference. IVMC'98 (Cat. No.98TH8382) Vacuum microelectronics Vacuum Microelectronics Conference, 1998. Eleventh International. :248-249 1998
Relation: Eleventh International Vacuum Microelectronics Conference. IVMC'98
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7دورية أكاديمية
المصدر: Applied Physics A: Materials Science & Processing. July 2005 81(2):357-361
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8دورية أكاديمية
المؤلفون: Qian, L., Jin, Z.S., Zhang, J.W., Huang, Y.B., Zhang, Z.J., Du, Z.L.
المصدر: Applied Physics A: Materials Science and Processing. May 2005 80(8):1801-1805
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9دورية أكاديمية
المؤلفون: Li, J.J. *, Gu, C.Z., Peng, H.Y., Wu, H.H., Zheng, W.T., Jin, Z.S.
المصدر: In Applied Surface Science 2005 251(1):236-241
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10دورية أكاديمية
المؤلفون: Hu, C.Q., Zheng, W.T. *, Zheng, B., Li, J.J., Jin, Z.S., Bai, X.M., Tian, H.W., Jiang, Q., Wang, X.Y., Zhu, J.Q., Meng, S.H., He, X.D., Han, J.C.
المصدر: In Vacuum 17 December 2004 77(1):63-68
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