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1دورية أكاديمية
المؤلفون: Dongjun Na, Jinbum Kim, Juseong Jeon, Sejin Park
المصدر: Sensors, Vol 23, Iss 20, p 8569 (2023)
مصطلحات موضوعية: internet of things, Web 3.0, Ethereum, application platform, service-oriented architecture, blockchain-based storage, Chemical technology, TP1-1185
وصف الملف: electronic resource
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2دورية أكاديمية
المؤلفون: Seung Woo Yang, Yun Kyong Hyon, Hyun Seok Na, Long Jin, Jae Geun Lee, Jong Mok Park, Ji Yong Lee, Ju Hyun Shin, Jae Sung Lim, Yong Gil Na, Kiwan Jeon, Taeyoung Ha, Jinbum Kim, Ki Hak Song
المصدر: BMC Urology, Vol 20, Iss 1, Pp 1-8 (2020)
مصطلحات موضوعية: Lithotripsy, Machine learning, Artificial intelligence, Diseases of the genitourinary system. Urology, RC870-923
وصف الملف: electronic resource
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3مؤتمر
المؤلفون: Jinbum Kim, Noquil, J.A., Teik keng Tan, Chung-Lin Wu, Seung-Yong Choi
المصدر: Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :1819-1821 Vol. 2 2005
Relation: 2005 Proceedings. 55th Electronic Components and Technology Conference
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4
المؤلفون: Jinbum, Kim, Seongheum, Choi, Taejin, Park, Jinyong, Kim, Chulsung, Kim, Taeho, Cha, Hyangsook, Lee, Eunha, Lee, Jung Yeon, Won, Hyung-Ik, Lee, Sangjin, Hyun, Sunjung, Kim, Dongsuk, Shin, Yihwan, Kim, Keewon, Kwon, Hyoungsub, Kim
المصدر: ACS applied materialsinterfaces. 9(1)
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5
المؤلفون: Chang-Ho Yeo, Jinbum Kim, Ki-Yeoung Kweon, Man-Jun Ha
المصدر: 2009 Transmission & Distribution Conference & Exposition: Asia and Pacific.
مصطلحات موضوعية: Quenching, Arc (geometry), Mass flux, Materials science, business.industry, Electric field, Nozzle, Electrical engineering, High voltage, Mechanics, Current (fluid), business, Circuit breaker
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::68e2b9e8da36fe2a40dcc0b5f4558815
https://doi.org/10.1109/td-asia.2009.5356810 -
6مؤتمر
المؤلفون: Man-Jun Ha, Jinbum Kim, Chang-Ho Yeo, Ki-Yeoung Kweon
المصدر: 2009 Transmission & Distribution Conference & Exposition: Asia & Pacific; 2009, p1-4, 4p