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المؤلفون: Jimmy Yang, Cheng Yu Chen, Jay Cy Huang, Jojo Tsai, Vincent Lee, J. L. Ku, Ander Hsieh, K. C. Li
المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
مصطلحات موضوعية: Surface-mount technology, Materials science, Stencil printing, Aperture, Laser cutting, Soldering, Ball grid array, Metallurgy, Solder paste, Composite material, Stencil
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::923b2af3d7b1a2df4be4452468325cab
https://doi.org/10.1109/impact.2010.5699642