المؤلفون: Zampino, M., Jones, W.K., Kappagantula, S.

المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :161-166 2006

Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems

المؤلفون: Zampino, M.A., Kandukuri, R., Jones, W.K.

المصدر: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on. :179-185 2002

Relation: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

المؤلفون: Jones, W.K., Liu, Y., Gao, M.

المصدر: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on. :230-235 2002

Relation: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

المؤلفون: Jones, W.K., Liu, Y.Q., Shah, M.

المصدر: Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Advanced packaging materials - processes, properties and interfaces Advanced Packaging Materials. Proceedings., 3rd International Symposium on. :64-67 1997

Relation: Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

المؤلفون: Harsanyi, G., Illyefalvi-Vitez, Z., Jones, W.K.

المصدر: 1996 Proceedings 46th Electronic Components and Technology Conference Electronic components and technology Electronic Components and Technology Conference, 1996. Proceedings., 46th. :765-771 1996

Relation: 1996 Proceedings 46th Electronic Components and Technology Conference

المؤلفون: Rong Zhuge, Jones, W.K.

المصدر: Proceedings of Southcon '95 Southcon '95 Southcon/95. Conference Record. :334-339 1995

Relation: Proceedings of Southcon '95

المؤلفون: Jones, W.K., Yanqing Liu, Mingcong Gao

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 26(1):110-115 Mar, 2003

المؤلفون: Jones, W.K., Jiang, W., Harshbarger, R.W., Zhuge, R.

المصدر: 1991 Proceedings 41st Electronic Components & Technology Conference Electronic Components and Technology Conference, 1991. Proceedings., 41st. :203-209 1991

Relation: 1991 Proceedings 41st Electronic Components & Technology Conference

المؤلفون: Mohammed, O.A., Zhou, M., Jones, W.K.

المصدر: IEEE Proceedings on Southeastcon Southeastcon '90. Proceedings., IEEE. :783-786 vol.3 1990

Relation: IEEE Proceedings on Southeastcon

المؤلفون: Lu, Q., Larkins, G.L., Jr., Jones, W.K., Kennedy, R.J., Chern, G.

المصدر: IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 27(2):1154-1157 Mar, 1991