المؤلفون: Ji, Y., Goo, H. J., Lim, J., Lee, S. B., Lee, S., Uemura, T., Park, J. C., Han, S. I., Shin, S. C., Lee, J. H., Song, Y. J., Lee, K. M., Shin, H. M., Hwang, S. H., Seo, B. Y., Lee, Y. K., Kim, J. C., Koh, G. H., Park, K. C., Pae, S., Jeong, G. T., Yoon, J. S., Jung, E. S.

المصدر: 2019 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2019 IEEE International. :1-3 Mar, 2019

Relation: 2019 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Lee, K., Bak, J. H., Kim, Y. J., Kim, C. K., Antonyan, A., Chang, D. H., Hwang, S. H., Lee, G. W., Ji, N. Y., Kim, W. J., Lee, J. H., Bae, B. J., Park, J. H., Kim, I. H., Seo, B. Y., Han, S. H., Ji, Y., Jung, H. T., Park, S. O., Kwon, O. I., Kye, J. W., Kim, Y. D., Pae, S. W., Song, Y. J., Jeong, G. T., Hwang, K. H., Koh, G. H., Kang, H. K., Jung, E. S.

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :2.2.1-2.2.4 Dec, 2019

Relation: 2019 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Park, J.-H., Lee, J., Jeong, J., Pi, U., Kim, W.K., Lee, S., Noh, E., Kim, K., Lim, W. C., Kwon, S., Bae, B.-J., Kim, I., Ji, N., Lee, K., Shin, H., Han, S. H., Hwang, S., Jeong, D., Oh, S. C., Park, S. O., Song, Y. J., Jeong, G. T., Koh, G. H., Hyun, S., Hwang, K., Nam, S. W., Kang, H. K., Jung, E. S.

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :2.5.1-2.5.4 Dec, 2019

Relation: 2019 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Kim, R.-H., Kim, B. H., Kim, J. N., Lee, J. J., Baek, J. M., Hwang, J. H., Hwang, J., Chang, J., Yoo, S. Y., Yim, T.-J., Chung, K.-M., Park, K. H., Oszinda, T., Kim, I S., Lee, E. B., Nam, S. D., Jung, S., Cho, Y. W., Choi, H. J., Kim, J. S., Ahn, S. H., Park, S. H., Yoon, B. U., Ku, J.-H., Paak, S. S., Lee, N.-I., Choi, S., Kang, H.-K., Jung, E. S.

المصدر: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International. :1-4 May, 2015

Relation: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

المؤلفون: Song, Y. J., Lee, J. H., Han, S. H., Shin, H. C., Lee, K. H., Suh, K., Jeong, D. E., Koh, G. H., Oh, S. C., Park, J. H., Park, S. O., Bae, B. J., Kwon, O. I., Hwang, K. H., Seo, B.Y., Lee, Y.K., Hwang, S. H., Lee, D. S., Ji, Y., Park, K.C., Jeong, G. T., Hong, H. S., Lee, K. P., Kang, H. K., Jung, E. S.

المصدر: 2018 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2018 IEEE International. :18.2.1-18.2.4 Dec, 2018

Relation: 2018 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Ha, Daewon, Yang, C., Lee, J., Lee, S., Lee, S. H., Seo, K.-I., Oh, H. S., Hwang, E. C., Do, S. W., Park, S. C., Sun, M.-C., Kim, D. H., Lee, J. H., Kang, M. I., Ha, S.-S., Choi, D. Y., Jun, H., Shin, H. J., Kim, Y. J., Moon, C. W., Cho, Y. W., Park, S. H., Son, Y., Park, J. Y., Lee, B. C., Kim, C., Oh, Y. M., Park, J. S., Kim, S. S., Kim, M. C., Hwang, K. H., Nam, S. W., Maeda, S., Kim, D.-W., Lee, J.-H., Liang, M. S., Jung, E. S.

المصدر: 2017 Symposium on VLSI Technology VLSI Technology, 2017 Symposium on. :T68-T69 Jun, 2017

Relation: 2017 Symposium on VLSI Technology

المؤلفون: Han, Kyu-Hee, Choi, Seungwook, Yim, Tae Jin, Choi, Seunghyuk, Baek, Jongmin, Ahn, Sang Hoon, Lee, Nae-In, Choi, Siyoung, Kang, Ho-Kyu, Jung, E S

المصدر: 2013 IEEE International Interconnect Technology Conference - IITC Interconnect Technology Conference (IITC), 2013 IEEE International. :1-3 Jun, 2013

Relation: 2013 IEEE International Interconnect Technology Conference - IITC

المؤلفون: Jung, E.-S., Bang, J., Lee, Y.-T., Ryu, W.

المصدر: IEEE Transactions on Consumer Electronics IEEE Trans. Consumer Electron. Consumer Electronics, IEEE Transactions on. 62(1):62-68 Feb, 2016

المؤلفون: Song, Y. J., Lee, J. H., Shin, H. C., Lee, K. H., Suh, K., Kang, J. R., Pyo, S. S., Jung, H. T., Hwang, S. H., Koh, G. H., Oh, S. C., Park, S. O., Kim, J. K., Park, J. C., Kim, J., Hwang, K. H., Jeong, G. T., Lee, K. P., Jung, E. S.

المصدر: 2016 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2016 IEEE International. :27.2.1-27.2.4 Dec, 2016

Relation: 2016 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Lee, J. H., Cho, S.-H., Lee, H.-H., Jung, E.-S., Yu, J.-H., Kim, B.-W., Lee, S.-H., Koh, J.-S., Sung, B.-H., Kang, S.-J., Kim, J.-H., Jeong, K.-T., Lee, S. S.

المصدر: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 28(4):344-351 Feb, 2010