يعرض 1 - 5 نتائج من 5 نتيجة بحث عن '"Junhu, Qin"', وقت الاستعلام: 0.78s تنقيح النتائج
  1. 1
    مؤتمر
    The influence of silver content on the reliability of lead-free solder joints under drop condition

    المؤلفون: Yongping, Lei, Jinli, Yang, Jian, Lin, Hanguang, Fu, Baoquan, Liu, Hailong, Bai, Junhu, Qin

    المصدر: 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :826-829 Aug, 2013

    Relation: 2013 14th International Conference on Electronic Packaging Technology (ICEPT)

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  2. 2
    دورية أكاديمية
    Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints

    المؤلفون: Dongdong Chen, Junhu Qin, Xin Zhang, Dongcheng Liang, Hailong Bai, Jianhong Yi, Jikang Yan

    المصدر: Materials, Vol 15, Iss 24, p 9004 (2022)

    مصطلحات موضوعية: SnAg3Cu0.5 solder, interfacial reaction, tensile strength, fracture mode, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

    وصف الملف: electronic resource

    Relation: https://www.mdpi.com/1996-1944/15/24/9004; https://doaj.org/toc/1996-1944

    URL الوصول: https://doaj.org/article/b37bf2dc42784d9e8209ef2cce9071e3

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  3. 3
    Effects of Ag3Sn nanoparticles and isothermal aging on IMC layer growth, mechanical properties, and life prediction of SAC305/Cu solder joints

    المؤلفون: Peng Yuan, Dongdong Chen, Junhu Qin, Hailong Bai, Xin Zhang, Guoyou Gan, Chongyan Leng, Jikang Yan

    المصدر: Composites and Advanced Materials. 32:263498332311635

    مصطلحات موضوعية: General Medicine

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b1d99d51ee791f20ca86c2355caa6750
    https://doi.org/10.1177/26349833231163598

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  4. 4
    دورية أكاديمية
    Effects of Ag3Sn nanoparticles and isothermal aging on IMC layer growth, mechanical properties, and life prediction of SAC305/Cu solder joints.

    المؤلفون: Peng Yuan, Dongdong Chen, Junhu Qin, Hailong Bai, Xin Zhang, Guoyou Gan, Chongyan Leng, Jikang Yan

    المصدر: Composites & Advanced Materials; Jan-Dec2023, Vol. 32, p1-10, 10p

    مصطلحات موضوعية: COPPER-tin alloys, SOLDER joints, SOLDER pastes, INTERFACIAL reactions, NANOPARTICLES, VICKERS hardness, WETTING

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  5. 5
    Synthesis and antitumor activity of novel pyridazinone derivatives containing 1,3,4-thiadiazole moiety

    المؤلفون: Liqiong Zhang, Jiamin Liu, Hongmei Zhu, Gui-Ping Ouyang, Yihong Fu, Mei Zhu, Junhu Qin, Zhenchao Wang

    مصطلحات موضوعية: Antitumor activity, 010405 organic chemistry, Chemistry, Stereochemistry, Organic Chemistry, Carbon-13 NMR, 010402 general chemistry, 01 natural sciences, Biochemistry, 0104 chemical sciences, Inorganic Chemistry, Proton NMR, Structure–activity relationship, Moiety

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7b973ffd9da993ae7daabb7f7db71994

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