المؤلفون: Hongliang Zhou, Andong Chang, Junling Fan, Jun Cao, Yingchong Zhang, Bin An, Jie Xia

المصدر: Micromachines, Vol 14, Iss 8, p 1587 (2023)

مصطلحات موضوعية: bond properties, EFO current, EFO time, ultrasonic power, bonding force, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/14/8/1587; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/3e2cc2788a6a4f9aa821245bd2928f5e

المؤلفون: Hongliang Zhou, Andong Chang, Junling Fan, Jun Cao, Bin An, Jie Xia, Jingguang Yao, Xiaobin Cui, Yingchong Zhang

المصدر: Micromachines, Vol 14, Iss 8, p 1612 (2023)

مصطلحات موضوعية: Cu wire bonding, FAB morphology, bonding reliability, intermetallic compounds, applications of simulations, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/14/8/1612; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/f1e56f62464f4183896ff5fa3f7dae48

المؤلفون: Xuefeng Wu, Hewei Jia, Junling Fan, Jun Cao, Chenghao Su

المصدر: Micromachines, Vol 14, Iss 8, p 1635 (2023)

مصطلحات موضوعية: multi-pass, pulling annealing, tensile strength, elongation, resistivity, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/14/8/1635; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/b2d99954f2af49a5a673cc1609cfe74a

المؤلفون: Lipan Zhang, Rui Deng, Ning Ning, Junling Fan, Wentao Wang, Kai Song

المصدر: Materials, Vol 15, Iss 15, p 5093 (2022)

مصطلحات موضوعية: aircraft long truss structure, crack detection, remote field eddy current, finite element simulation, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/15/15/5093; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/5bc21e40f85949d5a3117729edd32013

المؤلفون: Zhe Zhang, Jinping Ou, Dongsheng Li, Shuaifang Zhang, Junling Fan

المصدر: Frattura ed Integrità Strutturale, Vol 11, Iss 40, Pp 149-161 (2017)

مصطلحات موضوعية: Coupling beam damper, Hysteresis behavior, Energy dissipation, Fatigue damage, Mechanical engineering and machinery, TJ1-1570, Structural engineering (General), TA630-695

وصف الملف: electronic resource

Relation: http://www.gruppofrattura.it/pdf/rivista/numero40/numero_40_art_13.pdf; https://doaj.org/toc/1971-8993

URL الوصول: https://doaj.org/article/a1a6194dead449a2b9803725c37cb0b6

المؤلفون: Junling Fan, Dengke Dong, Li Chen, Xianmin Chen, Xinglin Guo

المصدر: Frattura ed Integrità Strutturale, Vol 9, Iss 33, Pp 463-470 (2015)

مصطلحات موضوعية: Weight function, Crack face displacement, Stress intensity factor, Center crack configuration, Mechanical engineering and machinery, TJ1-1570, Structural engineering (General), TA630-695

وصف الملف: electronic resource

Relation: http://www.gruppofrattura.it/pdf/rivista/numero33/numero_33_art_51.pdf; https://doaj.org/toc/1971-8993

URL الوصول: https://doaj.org/article/27f2586982b64bdb94da2b8937647830

المؤلفون: Cao, Jun, JunLing Fan, WenBin Gao

المصدر: 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :502-507 Apr, 2016

Relation: 2016 International Conference on Electronics Packaging (ICEP)

المؤلفون: Jun Cao, JunLing Fan, ZhiQiang Liu, YueMin Zhang

المصدر: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. :93-97 Apr, 2015

Relation: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

المؤلفون: Cao, Jun, JunLing Fan, ZhiQiang Liu, YueMin Zhang

المصدر: 2014 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2014 International Conference on. :623-629 Apr, 2014

Relation: 2014 International Conference on Electronics Packaging (ICEP)

المؤلفون: Kai Song, Shaodong Fu, Ning Ning, Junling Fan, Ximing Cui

المصدر: Nondestructive Testing and Evaluation. :1-18

مصطلحات موضوعية: Mechanics of Materials, Mechanical Engineering, General Physics and Astronomy, General Materials Science

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ee6a0690b27e77cbb74d3f97e61b3a44
https://doi.org/10.1080/10589759.2023.2183953