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1دورية أكاديمية
المؤلفون: A. Sitati, E. Joe, B. Pentz, C. Grayson, C. Jaime, E. Gilmore, E. Galappaththi, A. Hudson, G. Nagle Alverio, K. J. Mach, M. van Aalst, N. Simpson, P. Nayna Schwerdtle, S. Templeman, Z. Zommers, I. Ajibade, L. S. Safaee Chalkasra, P. Umunay, I. Togola, A. Khouzam, G. Scarpa, Global Adaptation Mapping Initiative Team, E. Coughlan de Perez
المصدر: Discover Sustainability, Vol 2, Iss 1, Pp 1-15 (2021)
مصطلحات موضوعية: Environmental sciences, GE1-350
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2662-9984
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2دورية أكاديمية
المؤلفون: N. W. Feinstein, K. J. Mach
المصدر: Taylor & Francis Journals, Climate Policy. 20(3):317-322
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3دورية أكاديمية
المؤلفون: P. A. Turner, C. B. Field, D. B. Lobell, D. L. Sanchez, K. J. Mach
المصدر: Nature, Nature Sustainability. 1(5):240-245
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4دورية أكاديمية
المؤلفون: P. A. Turner, K. J. Mach, D. B. Lobell, S. M. Benson, E. Baik, D. L. Sanchez, C. B. Field
المصدر: Springer, Climatic Change. 148(1):1-10
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5
المؤلفون: J. S. Deboy, K. J. Mach, Arthur S. Francomacaro, R.L. Edwards, Harry K. Charles, S. J. Lehtonen
المصدر: Microelectronics Reliability. 43:141-153
مصطلحات موضوعية: Engineering drawing, Wire bonding, Materials science, Bond strength, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Transducer, Ball bonding, Ball (bearing), Ultrasonic sensor, Direct shear test, Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, Voltage
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المؤلفون: Arthur S. Francomacaro, R.L. Edwards, Harry K. Charles, J. S. Deboy, K. J. Mach, S. J. Lehtonen
المصدر: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
مصطلحات موضوعية: chemistry.chemical_classification, Wire bonding, Materials science, business.industry, Electrical engineering, Polymer, Welding, law.invention, Transducer, Reliability (semiconductor), chemistry, law, Ultrasonic sensor, Composite material, business, Sensitivity (electronics), Polyimide
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1e41d3a73f675db16b1694dc812bdd6f
https://doi.org/10.1109/ectc.2002.1008204 -
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المؤلفون: K. J. Mach, H.K. Jr. Charles, S. J. Lehtonen, David M. Lee, R.L. Edwards
المصدر: Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154).
مصطلحات موضوعية: Wire bonding, Interconnection, Fabrication, Materials science, business.industry, Detector, Mechanical engineering, Ultrasonic sensor, Direct shear test, Integrated circuit packaging, Structural engineering, business, Thermosonic bonding
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5ba7ebb50093ac11677ad606f97f7cd1
https://doi.org/10.1109/icmcm.1998.670797 -
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المؤلفون: R.L. Edwards, Harry K. Charles, K. J. Mach, D.M. Lee, S. J. Lehtonen
المصدر: 1997 Proceedings 47th Electronic Components and Technology Conference.
مصطلحات موضوعية: Interconnection, Wire bonding, Materials science, Electronic product, visual_art, Composite number, Metallurgy, visual_art.visual_art_medium, Nanotechnology, Substrate (printing), Ceramic, Ball shear, Gold ball
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bb42f381316582b25019d3367f69200e
https://doi.org/10.1109/ectc.1997.606243 -
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المؤلفون: S. J. Snodgrass, Neil Gehrels, Kelley Hu, A. M. Parsons, Z. Q. Shi, Peter K. Shu, L. M. Barbier, Scott Barthelmy, K. J. Mach, Carl Michael Stahle, D. M. Palmer, John F. Krizmanic, S. J. Lehtonen
المصدر: MRS Proceedings. 487
مصطلحات موضوعية: Fabrication, Materials science, Optics, business.industry, Detector, Medical imaging, Detector array, Spectroscopy, business, Gamma-ray burst, High resolution imaging
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10دورية أكاديمية
المؤلفون: Feinstein, N. W.
المساهمون: Mach, K. J. (VerfasserIn)
المصدر: Climate policy : London [u.a.], vol 20, issue 3, pg. 317-322. 2020
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