-
1مؤتمر
المؤلفون: Ikegami, Yukako, Onodera, Takumi, Chiyozono, Masanori, Sakamoto, Akihisa, Shimizu, Kan, Kagawa, Yoshihisa, Iwamoto, Hayato
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :299-304 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
-
2مؤتمر
المؤلفون: Urata, Akihiro, Kamei, Takahiro, Sakamoto, Akihisa, Yoshioka, Hirotaka, Hirano, Takaaki, Shimizu, Kan, Kagawa, Yoshihisa, Iwamoto, Hayato
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :56-61 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
-
3مؤتمر
المؤلفون: Haneda, Masaki, Ikegami, Yukako, Kotoo, Kengo, Shimizu, Kan, Kagawa, Yoshihisa, Iwamoto, Hayato
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1342-1346 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
-
4مؤتمر
المؤلفون: Kagawa, Akito, Inoue, Mao, Matsushima, Tohlu, Fukumoto, Yuki
المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :457-460 May, 2024
Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)
-
5تقرير
المؤلفون: Furuta, Soju, Koshibae, Wataru, Matsuura, Keisuke, Abe, Nobuyuki, Wang, Fei, Zhou, Shuyun, Arima, Taka-hisa, Kagawa, Fumitaka
مصطلحات موضوعية: Condensed Matter - Materials Science
URL الوصول: http://arxiv.org/abs/2407.00309
-
6مؤتمر
المؤلفون: Chen, Wei, Ren, Yihui, Kagawa, Ai, Carbone, Matthew R., Chen, Samuel Yen-Chi, Qu, Xiaohui, Yoo, Shinjae, Clyde, Austin, Ramanathan, Arvind, Stevens, Rick L., van Dam, Hubertus J. J., Lu, Deyu
المصدر: 2023 International Conference on Machine Learning and Applications (ICMLA) ICMLA Machine Learning and Applications (ICMLA), 2023 International Conference on. :800-807 Dec, 2023
Relation: 2023 International Conference on Machine Learning and Applications (ICMLA)
-
7دورية أكاديمية
المؤلفون: Brimdyr, K, Stevens, J, Svensson, K, Blair, A, Turner-Maffei, C, Grady, J, Bastarache, L, al Alfy, A, Crenshaw, JT, Giugliani, ERJ, Ewald, U, Haider, R, Jonas, W, Kagawa, M, Lillieskold, S, Maastrup, R, Sinclair, R, Swift, E, Takahashi, Y, Cadwell, K
المصدر: Acta paediatrica (Oslo, Norway : 1992). 112(8):1633-1643
مصطلحات موضوعية: Medicin och hälsovetenskap
-
8تقرير
-
9مؤتمر
المؤلفون: Paredes, Alvaro Lopez, Conde, Miguel Heredia, Ibrahim, Thoriq, Pham, Anh Ngoc, Kagawa, Keiichiro
المصدر: 2023 31st European Signal Processing Conference (EUSIPCO) European Signal Processing Conference (EUSIPCO), 2023 31st. :461-465 Sep, 2023
Relation: 2023 31st European Signal Processing Conference (EUSIPCO)
-
10مؤتمر
المؤلفون: Miyawaki, Takuhiro, Haneda, Masaki, Fukumizu, Yukari, Sakamoto, Akihisa, Shimizu, Kan, Kagawa, Yoshihisa, Iwamoto, Hayato
المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :105-106 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)