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1مؤتمر
المؤلفون: Pham, D., Behnen, E., Bolliger, M., Hofstee, H.P., Johns, C., Kahle, J., Kameyama, A., Keaty, J., Le, B., Masubuchi, Y., Posluszny, S., Riley, M., Suzuoki, M., Wang, M., Warnock, J., Weitzel, S., Wendel, D., Yazawa, K.
المصدر: Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005. Custom Integrated Circuits Custom Integrated Circuits Conference, 2005. Proceedings of the IEEE 2005. :45-49 2005
Relation: Proceedings of the IEEE 2005 Custom Integrated Circuits Conference
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2مؤتمر
المؤلفون: Pham, D., Asano, S., Bolliger, M., Day, M.N., Hofstee, H.P., Johns, C., Kahle, J., Kameyama, A., Keaty, J., Masubuchi, Y., Riley, M., Shippy, D., Stasiak, D., Suzuoki, M., Wang, M., Warnock, J., Weitzel, S., Wendel, D., Yamazaki, T., Yazawa, K.
المصدر: 2005 International Conference on Integrated Circuit Design and Technology, 2005. ICICDT 2005. Integrated circuit design and technology Integrated Circuit Design and Technology, 2005. ICICDT 2005. 2005 International Conference on. :49-52 2005
Relation: 2005 International Conference on Integrated Circuit Design and Technology
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3دورية أكاديمية
المؤلفون: Wendel, D. F., Kalla, R., Warnock, J., Cargnoni, R., Chu, S. G., Clabes, J. G., Dreps, D., Hrusecky, D., Friedrich, J., Islam, S., Kahle, J., Leenstra, J., Mittal, G., Paredes, J., Pille, J., Restle, P. J., Sinharoy, B., Smith, G., Starke, W. J., Taylor, S., Van Norstrand, A. J., Weitzel, S., Williams, P. G., Zyuban, V.
المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 46(1):145-161 Jan, 2011
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4دورية أكاديمية
المؤلفون: Pham, D.C., Aipperspach, T., Boerstler, D., Bolliger, M., Chaudhry, R., Cox, D., Harvey, P., Harvey, P.M., Hofstee, H.P., Johns, C., Kahle, J., Kameyama, A., Keaty, J., Masubuchi, Y., Pham, M., Pille, J., Posluszny, S., Riley, M., Stasiak, D.L., Suzuoki, M., Takahashi, O., Warnock, J., Weitzel, S., Wendel, D., Yazawa, K.
المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 41(1):179-196 Jan, 2006
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5دورية أكاديمية
المؤلفون: Brettschneider, K., Schmidt, A., Kahle, J., Orlowski, A., Stichel, D., Schwabe, D., Königs, C. *
المصدر: In Journal of Thrombosis and Haemostasis November 2018 16(11):2223-2232
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6دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
7مؤتمر
المؤلفون: Dac Pham, Kahle, J., Ogden, D., Putrino, M., Tai Ngo, Hoover, K., Cang Tran, Sweet, M., Hung Hua, Quan Nguyen, Mallick, S., Eisen, L., Loper, A., Chitturi, R., Lyon, T., Ho, B., Patel, R., Cheesebrough, E., Kuttanna, B., Piejko, A.
المصدر: Proceedings ISSCC '95 - International Solid-State Circuits Conference Solid-state circuits Solid-State Circuits Conference, 1995. Digest of Technical Papers. 41st ISSCC, 1995 IEEE International. :180-181 1995
Relation: Proceedings ISSCC '95 - International Solid-State Circuits Conference
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8دورية أكاديمية
المؤلفون: Gerosa, G., Gary, S., Dietz, C., Dac Pham, Hoover, K., Alvarez, J., Sanchez, H., Ippolito, P., Tai Ngo, Litch, S., Eno, J., Golab, J., Vanderschaaf, N., Kahle, J.
المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 29(12):1440-1454 Dec, 1994
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9Editorial & Opinion
المؤلفون: Kahle, J. B., Tobin, K. G., Rogg, S. R.
Peer Reviewed: N
Page Count: 53
Sponsoring Agency: National Science Foundation, Washington, DC.
Descriptors: Academic Achievement, Administrators, Classroom Communication, Educational Change, Educational Environment, Intermediate Grades, Interviews, Junior High Schools, Middle Schools, Participant Observation, School Visitation
مصطلحات جغرافية: Ohio
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10مؤتمر
المؤلفون: Pham, D., Anderson, H.W., Behnen, E., Bolliger, M., Gupta, S., Hofstee, P., Harvey, P., Johns, C., Kahle, J., Kameyama, A., Keaty, J., Le, B., Sang Lee, Tuyen Nguyen, Petrovick, J., Mydung Pham Pille, J., Posluszny, S., Riley, M., Verock, J., Warnock, J., Weitzel, S., Wendel, D.
المصدر: Asia and South Pacific Conference on Design Automation, 2006. Design Automation Design Automation, 2006. Asia and South Pacific Conference on. :8 pp. 2006
Relation: Proceedings of the ASP-DAC 2006. Asia and South Pacific Design Automation Conference 2006