المؤلفون: Tatsuro Yoshida, Makoto Tsukahara, Haley Fu, Ron W. Kulterman, Kei Murayama, Arvind Purushotaman, Wei Keat Loh, Jenn An Wang, Kang Eu Ong

المصدر: 2021 International Conference on Electronics Packaging (ICEP).

مصطلحات موضوعية: Semiconductor industry, Substrate (building), Materials science, Silicon, chemistry, Semiconductor device modeling, chemistry.chemical_element, Mechanical engineering, Wafer, Material properties, Temperature measurement, Predictive modelling

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0395fe6a4d717359985365a8c132a20d
https://doi.org/10.23919/icep51988.2021.9451946

المؤلفون: Ron W. Kulterman, Chih Chung Hsu, Haley Fu, Wei Keat Loh, Jenn An Wang, Kang Eu Ong

المصدر: 2019 International Conference on Electronics Packaging (ICEP).

مصطلحات موضوعية: 010302 applied physics, Property (programming), business.industry, Computer science, 05 social sciences, Mechanical engineering, Computational fluid dynamics, 01 natural sciences, Finite element method, Superposition principle, Electronic packages, 0103 physical sciences, 0501 psychology and cognitive sciences, Representation (mathematics), business, Predictive modelling, 050104 developmental & child psychology, Shrinkage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9019b893145f90678f84ab14c6ec61c1
https://doi.org/10.23919/icep.2019.8733601

المؤلفون: Kankanhalli N. Seetharamu, Kor Oon Lee, G.A. Quadir, Kang Eu Ong, Ishak Abdul Azid, Teck Joo Goh, Zainal Alimuddin Zainal

المصدر: Microelectronics International. 22:10-15

مصطلحات موضوعية: Surface (mathematics), Engineering, Fin, business.industry, Electronic packaging, Electrical engineering, Mechanical engineering, Thermal management of electronic devices and systems, Heat transfer coefficient, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Volume (thermodynamics), Thermal, Range (statistics), Electrical and Electronic Engineering, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::86d8218f6a9f593ae7eb8e4f8e00aa1c
https://doi.org/10.1108/13565360510575495

المؤلفون: Kang Eu Ong, Paramjeet S Gill, Yung Hsiang Lee, Shaw Fong Wong, Kah Kee Tan, Wei Keat Loh

المصدر: 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).

مصطلحات موضوعية: Surface-mount technology, Reflow soldering, Reliability (semiconductor), Materials science, JEDEC memory standards, Ball grid array, Soldering, Electronic engineering, Mechanical engineering, Coplanarity, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b367257cdc2b35b903006398a36fd19d
https://doi.org/10.1109/iemt.2010.5746680

المؤلفون: Seok Ling Lee, Huey Ling Lew, Kang Eu Ong, Shaw Fong Wong, Yung Hsiang Lee, Wei Keat Loh

المصدر: 2006 International Conference on Electronic Materials and Packaging.

مصطلحات موضوعية: Electronic packages, Materials science, business.industry, Soldering, Heat spreader, Integrated circuit packaging, Structural engineering, business, Shock (mechanics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::87a7698c957275807f769b3d2fff3959
https://doi.org/10.1109/emap.2006.4430588

المؤلفون: Wei Keat Loh, Kang Eu Ong, Chee Kan Lee, Ian Chin

المصدر: 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.

مصطلحات موضوعية: Surface-mount technology, Thermal copper pillar bump, Substrate (building), Materials science, Chip-scale package, Heat spreader, Electronic engineering, Mechanical engineering, Finite element method, Die (integrated circuit), Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::19c539d4076a8d809e712dadb92519cc
https://doi.org/10.1109/iemt.2006.4456453

المؤلفون: Chee Kan Lee, Wei Keat Loh, Kang Eu Ong, Chin, I.

المصدر: 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium; 2006, p185-190, 6p

المؤلفون: Kang Eu Ong, Wei Kea Loh, Chee Wai Wong, Yeen San Yip, Choi Keng Chan, Lim, S.A., Seok Ling Lee, Ganapathysubramanian, S.

المصدر: 2006 International Conference on Electronic Materials & Packaging; 2006, p1-7, 7p

المؤلفون: Shaw Fong Wong, Wei Keat Loh, Kang Eu Ong, Yung Hsiang Lee, Huey Ling Lew, Seok Ling Lee

المصدر: 2006 International Conference on Electronic Materials & Packaging; 2006, p1-10, 10p