المؤلفون: Yu Hu, Wei-Pin Changchien, Sandeep C. Eruvathi, Ruifeng Guo, S. Pan, Liyang Lai, Ting-Pu Tai, Xiaowei Li, Jing Ye, Yu Huang, Charles C. C. Liu, Ji-Jan Chen, Daw-Ming Lee, Kartik K. Kumara, Wu-Tung Cheng

المصدر: ITC

مصطلحات موضوعية: Engineering, Boundary scan, business.industry, Design for testing, Real-time computing, Scan chain, Test compression, Automatic test pattern generation, Chip, Image stitching, Hardware and Architecture, Fault coverage, Benchmark (computing), Hardware_INTEGRATEDCIRCUITS, Overhead (computing), Electrical and Electronic Engineering, Routing (electronic design automation), business, Software, Computer hardware

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5fa2ef08b254145b5939c9f30c4f8919
https://doi.org/10.1109/test.2013.6651929