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1مؤتمر
المؤلفون: Toledano-Luque, M., Paliwoda, P., Nour, M., Kauerauf, T., Min, B., Bossu, G., Siddabathula, M., Nigam, T.
المصدر: 2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-6 Mar, 2021
Relation: 2021 IEEE International Reliability Physics Symposium (IRPS)
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2مؤتمر
المؤلفون: Toledano-Luque, M., Srinivasan, P., Paliwoda, P., Cimino, S., Chbili, Z., Mahmud, M.I., Gupta, A., Shen, T., Kauerauf, T., Zhu, B., Min, B., Nigam, T.
المصدر: 2019 Electron Devices Technology and Manufacturing Conference (EDTM) Electron Devices Technology and Manufacturing Conference (EDTM), 2019. :218-221 Mar, 2019
Relation: 2019 Electron Devices Technology and Manufacturing Conference (EDTM)
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3مؤتمر
المؤلفون: Demuynck, S., Mao, M., Kunnen, E., Versluijs, J., Croes, K., Wu, C., Schaekers, M., Peter, A., Kauerauf, T., Teugels, L., Bommels, J.
المصدر: IEEE International Interconnect Technology Conference Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International. :307-310 May, 2014
Relation: 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)
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4مؤتمر
المؤلفون: Aoulaiche, M., Simoen, E., Ritzenthaler, R., Schram, T., Arimura, H., Cho, M., Kauerauf, T., Groeseneken, G., Horiguchi, N., Thean, A., Federico, A., Crupi, F., Spessot, A., Caillat, C., Fazan, P., Na, H.-J., Son, Y., Noh, K. B.
المصدر: 2013 Proceedings of the European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), 2013 Proceedings of the European. :190-193 Sep, 2013
Relation: ESSDERC 2013 - 43rd European Solid State Device Research Conference
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5مؤتمر
المؤلفون: Groeseneken, G., Aoulaiche, M., Cho, M., Franco, J., Kaczer, B., Kauerauf, T., Mitard, J., Ragnarsson, Lars-Ake, Roussel, P., Toledano-Luque, M.
المصدر: Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the. :41-50 Jul, 2013
Relation: 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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6مؤتمر
المؤلفون: Franco, J., Kaczer, B., Mitard, J., Toledano-Luque, M., Crupi, F., Eneman, G., Rousse, Ph. J., Grasser, T., Cho, M., Kauerauf, T., Witters, L., Hellings, G., Ragnarsson, L.-A, Horiguchi, N., Heyns, M., Groeseneken, G.
المصدر: 2012 IEEE International Conference on IC Design & Technology IC Design & Technology (ICICDT), 2012 IEEE International Conference on. :1-4 May, 2012
Relation: 2012 IEEE International Conference on IC Design & Technology (ICICDT)
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7مؤتمر
المؤلفون: Li, Y.-L., Velenis, D., Kauerauf, T., Stucchi, M., Civale, Y., Redolfi, A., Croes, K.
المصدر: 2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :304-308 May, 2012
Relation: 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)
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8مؤتمر
المؤلفون: Sahhaf, S., Degraeve, R., Srividya, V., Cho, M., Kauerauf, T., Groeseneken, G.
المصدر: 2010 IEEE International Reliability Physics Symposium Reliability Physics Symposium (IRPS), 2010 IEEE International. :1078-1081 May, 2010
Relation: 2010 IEEE International Reliability Physics Symposium (IRPS)
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9دورية أكاديمية
المؤلفون: Cho, M., Arimura, H., Lee, J. W., Kaczer, B., Veloso, A., Boccardi, G., Ragnarsson, L.-A., Kauerauf, T., Horiguchi, N., Groeseneken, G.
المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 14(1):408-412 Mar, 2014
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10دورية أكاديمية
المؤلفون: Cho, M., Roussel, P., Kaczer, B., Degraeve, R., Franco, J., Aoulaiche, M., Chiarella, T., Kauerauf, T., Horiguchi, N., Groeseneken, G.
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 60(12):4002-4007 Dec, 2013