المؤلفون: Toledano-Luque, M., Paliwoda, P., Nour, M., Kauerauf, T., Min, B., Bossu, G., Siddabathula, M., Nigam, T.

المصدر: 2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-6 Mar, 2021

Relation: 2021 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Toledano-Luque, M., Srinivasan, P., Paliwoda, P., Cimino, S., Chbili, Z., Mahmud, M.I., Gupta, A., Shen, T., Kauerauf, T., Zhu, B., Min, B., Nigam, T.

المصدر: 2019 Electron Devices Technology and Manufacturing Conference (EDTM) Electron Devices Technology and Manufacturing Conference (EDTM), 2019. :218-221 Mar, 2019

Relation: 2019 Electron Devices Technology and Manufacturing Conference (EDTM)

المؤلفون: Demuynck, S., Mao, M., Kunnen, E., Versluijs, J., Croes, K., Wu, C., Schaekers, M., Peter, A., Kauerauf, T., Teugels, L., Bommels, J.

المصدر: IEEE International Interconnect Technology Conference Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International. :307-310 May, 2014

Relation: 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)

المؤلفون: Aoulaiche, M., Simoen, E., Ritzenthaler, R., Schram, T., Arimura, H., Cho, M., Kauerauf, T., Groeseneken, G., Horiguchi, N., Thean, A., Federico, A., Crupi, F., Spessot, A., Caillat, C., Fazan, P., Na, H.-J., Son, Y., Noh, K. B.

المصدر: 2013 Proceedings of the European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), 2013 Proceedings of the European. :190-193 Sep, 2013

Relation: ESSDERC 2013 - 43rd European Solid State Device Research Conference

المؤلفون: Groeseneken, G., Aoulaiche, M., Cho, M., Franco, J., Kaczer, B., Kauerauf, T., Mitard, J., Ragnarsson, Lars-Ake, Roussel, P., Toledano-Luque, M.

المصدر: Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the. :41-50 Jul, 2013

Relation: 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Franco, J., Kaczer, B., Mitard, J., Toledano-Luque, M., Crupi, F., Eneman, G., Rousse, Ph. J., Grasser, T., Cho, M., Kauerauf, T., Witters, L., Hellings, G., Ragnarsson, L.-A, Horiguchi, N., Heyns, M., Groeseneken, G.

المصدر: 2012 IEEE International Conference on IC Design & Technology IC Design & Technology (ICICDT), 2012 IEEE International Conference on. :1-4 May, 2012

Relation: 2012 IEEE International Conference on IC Design & Technology (ICICDT)

المؤلفون: Li, Y.-L., Velenis, D., Kauerauf, T., Stucchi, M., Civale, Y., Redolfi, A., Croes, K.

المصدر: 2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :304-308 May, 2012

Relation: 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Sahhaf, S., Degraeve, R., Srividya, V., Cho, M., Kauerauf, T., Groeseneken, G.

المصدر: 2010 IEEE International Reliability Physics Symposium Reliability Physics Symposium (IRPS), 2010 IEEE International. :1078-1081 May, 2010

Relation: 2010 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Cho, M., Arimura, H., Lee, J. W., Kaczer, B., Veloso, A., Boccardi, G., Ragnarsson, L.-A., Kauerauf, T., Horiguchi, N., Groeseneken, G.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 14(1):408-412 Mar, 2014

المؤلفون: Cho, M., Roussel, P., Kaczer, B., Degraeve, R., Franco, J., Aoulaiche, M., Chiarella, T., Kauerauf, T., Horiguchi, N., Groeseneken, G.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 60(12):4002-4007 Dec, 2013