المؤلفون: Kikuchi, A., Iijima, Y., Yamamoto, M., Kawano, M., Otsubo, M.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 32(4):1-4 Jun, 2022

المؤلفون: Kikuchi, A., Iijima, Y., Nimori, S., Yamamoto, M., Kawano, M., Kimura, M., Nagamatsu, J., Otsubo, M., Ichinose, A., Tsuchiya, K.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 31(5):1-5 Aug, 2021

المؤلفون: Nishimoto, Y., Akiyama, Y., Tsujimoto, H., Kawano, M., Miura, K.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 31(5):1-5 Aug, 2021

المؤلفون: Li, H. Y., Kawano, M., Ji, L, Ji, H. M., Lim, C. S.

المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :468-471 Dec, 2020

Relation: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

المؤلفون: Ji, L., Che, F.X., Ji, H.M., Li, H.Y., Kawano, M.

المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :87-94 Dec, 2019

Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

المؤلفون: Li, H. Y., Kawano, M., Lim, P. S., Che, F. X., Chua, H. M.

المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :258-262 Dec, 2019

Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

المؤلفون: Ji, L., Che, F.X., Ji, H.M., Li, H.Y., Kawano, M.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(12):2106-2117 Dec, 2020

المؤلفون: Li, H.-Y., Kawano, M., Lim, S., Cereno, D.I., Sekhar, V.N.

المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :495-499 Dec, 2018

Relation: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Takezaki, T., Kawano, M., Hasegawa, H., Machida, S., Ryuzaki, D.

المصدر: 2017 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2017 IEEE International. :1-4 Sep, 2017

Relation: 2017 IEEE International Ultrasonics Symposium (IUS)

المؤلفون: Che, F. X., Kawano, M., Ding, M. Z., Han, Y., Bhattacharya, S.

المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :853-861 May, 2017

Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)