المؤلفون: Goel, Sandeep K., Adham, Saman, Wang, Min-Jer, Lee, Frank, Chickermane, Vivek, Keller, Brion L., Valind, Thomas, Marinissen, Erik Jan, Franzon, P.D., Marinissen, E.J., Bakir, M.S.

المساهمون: Electronic Systems

المصدر: Handbook of 3D integration: volume 4: design, test, and thermal management, 325-346
STARTPAGE=325;ENDPAGE=346;TITLE=Handbook of 3D integration

مصطلحات موضوعية: Interconnection, business.product_category, business.industry, Computer science, media_common.quotation_subject, Stacking, Process (computing), Three-dimensional integrated circuit, Debugging, Embedded system, Hardware_INTEGRATEDCIRCUITS, Die (manufacturing), business, Design paradigm, Dram, media_common

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::be4f477eabebb88e73dfb92ae478f44b
https://doi.org/10.1002/9783527697052.ch15

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.