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1مؤتمر
المؤلفون: Chong, D.Y.R., Kellin Ng, Tan, J.Y.N., Low, P.T.H., Pang, J.H.L., Che, F.X., Xiong, B.S., Xu, L.H.
المصدر: Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :622-629 2005
Relation: 2005 Proceedings. 55th Electronic Components and Technology Conference
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المؤلفون: Kellin Ng, Lifeng Xu, John H. L. Pang, B.S. Xiong, Desmond Y.R. Chong, J.Y.N. Tan, Fa Xing Che, Patrick T. H. Low
المصدر: Scopus-Elsevier
مصطلحات موضوعية: Printed circuit board, Materials science, Drop (liquid), Soldering, Ball grid array, Metallurgy, Electroless nickel immersion gold, Integrated circuit packaging, Composite material, Drop test, Drop impact
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::08e4cf85f98c968d09428c56790a5dc9
http://www.scopus.com/inward/record.url?eid=2-s2.0-24644481526&partnerID=MN8TOARS