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1
المؤلفون: Andrzej J. Strojwas, Tomasz Brozek, Kelvin Doong, Indranil De, Xumin William Shen, Marcin Strojwas
المصدر: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6162a4a0cf966db4771f3524a53e0466
https://doi.org/10.1109/edtm53872.2022.9798308 -
2
المؤلفون: Roberto Gonella, Tomasz Brozek, Meindert Lunenborg, J.-C. Giraudin, Christopher Hess, B. Martinet, Franck Arnaud, Laurent Garchery, Kelvin Doong, Christian Dutto
المصدر: 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
مصطلحات موضوعية: Computer science, Process (engineering), law, Transistor, Electronic engineering, Silicon on insulator, New device, Characterization (materials science), law.invention
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a72e8b73807c533b30a2107a5789d234
https://doi.org/10.1109/s3s46989.2019.9320727 -
3
المؤلفون: Dennis Ciplickas, Andrzej Strojwas, Kelvin Doong
المصدر: MIXDES
مصطلحات موضوعية: 010302 applied physics, 010308 nuclear & particles physics, Computer science, Page layout, Extreme ultraviolet lithography, Yield (finance), Overlay, Integrated circuit, computer.software_genre, 01 natural sciences, Reliability engineering, law.invention, Reliability (semiconductor), law, 0103 physical sciences, Node (circuits), Enhanced Data Rates for GSM Evolution, computer, Reliability (statistics), Parametric statistics
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::891f39d2a4df835fc6b42f80808b3d5d
https://doi.org/10.23919/mixdes.2019.8787167 -
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المؤلفون: Dennis Ciplickas, Kelvin Doong, Bill Nehrer
المصدر: 2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM).
مصطلحات موضوعية: Engineering, Test site, business.industry, Yield (chemistry), Product (mathematics), Electronic engineering, Key (cryptography), Process control, Observability, business, Reliability engineering, Parametric statistics
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2483ea0cf93d26d54971603b2732f08e
https://doi.org/10.1109/edtm.2017.7947529 -
5
المؤلفون: Sheng-Che Lin, Kelvin Doong, Fei-Long Chen
المصدر: Journal of the Chinese Institute of Industrial Engineers. 27:281-293
مصطلحات موضوعية: Engineering, Semiconductor device fabrication, business.industry, Polishing, Integrated circuit, Integrated circuit design, Topology, Integrated circuit layout, Industrial and Manufacturing Engineering, Design for manufacturability, law.invention, Minimum-variance unbiased estimator, law, Range (statistics), Electronic engineering, business
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المؤلفون: L. J. Hung, Kelvin Doong, Sheng-Che Lin, T.J. Bordelon, Chien-Chih Liao, S.P.-S. Ho, Sunnys Hsieh, K.L. Young
المصدر: IEEE Transactions on Semiconductor Manufacturing. 21:169-179
مصطلحات موضوعية: Engineering, business.industry, Design specification, Design for testing, Integrated circuit design, Automatic test pattern generation, Condensed Matter Physics, Chip, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Design for manufacturability, Logic synthesis, Logic gate, Electronic engineering, Electrical and Electronic Engineering, business
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المؤلفون: Philip Chia-Chi Lin, Kelvin Doong, K.L. Young, Sunnys Hsieh, Sheng-Che Lin, Chia-Chi Chu, Jurcy Cho-Hsi Huang, S.P.-S. Ho, Roger Wen-Lung Kang, Robin Chien-Jung Wang, L. J. Hung
المصدر: IEEE Transactions on Semiconductor Manufacturing. 17:123-141
مصطلحات موضوعية: Engineering, business.industry, Circuit design, Design for testing, Design flow, Test method, Condensed Matter Physics, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Reliability engineering, Automatic test equipment, Electronic design automation, Electrical and Electronic Engineering, Test plan, business, Simulation, Test data
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8
المؤلفون: Larg Weiland, Hans Eisenmann, Amit Joag, Kelvin Doong, Scott Lin, Sa Zhao, Balasubramania Murugan, Christopher Hess
المصدر: 2014 International Conference on Microelectronic Test Structures (ICMTS).
مصطلحات موضوعية: Engineering, business.industry, Spice, Transistor, Electrical engineering, Process (computing), Hardware_PERFORMANCEANDRELIABILITY, Chip, law.invention, law, Product (mathematics), New product development, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Wafer, business, Front end of line
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::eeae7f7a9c0abbba7b31729bc097a4b6
https://doi.org/10.1109/icmts.2014.6841496 -
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المؤلفون: Sunnys Hsieh, Che-Hsiung Hsu, Larg Weiland, Ding-Ming Kwai, Kelvin Doong, Jye-Yen Cheng, Christopher Hess, Binson Shen, Sheng-Che Lin
المصدر: IEEE Transactions on Semiconductor Manufacturing. 14:338-355
مصطلحات موضوعية: Engineering, Semiconductor device fabrication, business.industry, Circuit design, Frame (networking), System testing, Process design, Test method, Condensed Matter Physics, Chip, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Application-specific integrated circuit, Embedded system, Electrical and Electronic Engineering, business
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المؤلفون: Shyue-Shyh Lin, H.C. Tseng, S. Pan, Keh-Jeng Chang, Akis Dagonis, Kelvin Doong
المصدر: 2009 IEEE International Conference on Microelectronic Test Structures.
مصطلحات موضوعية: Resistive touchscreen, Engineering, business.industry, Capacitive sensing, Electrical engineering, Integrated circuit design, Chip, Capacitance, law.invention, Capacitor, CMOS, law, Electronic engineering, Resistor, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fc4a7da7050da2eebcc0d8e0e8b79f1d
https://doi.org/10.1109/icmts.2009.4814645