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المؤلفون: Hiromi Suda, Douglas Shelton, Hiroki Takada, Yoshio Goto, Kosuke Urushihara, Ken-Ichiro Shinoda
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f845e89fe3f14dc5d224e452712eee2f
https://doi.org/10.1109/ectc51906.2022.00317 -
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المؤلفون: Douglas Shelton, Hiromi Suda, Ken-ichiro Shinoda, Kenichiro Mori, Kosuke Urushihara, Yoshio Goto
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Image stitching, Printed circuit board, Wafer-scale integration, Computer science, Bandwidth (signal processing), Electronic engineering, Production (computer science), Stepper, Wafer-level packaging, Die (integrated circuit)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f0e756cfb1a62489b197eaf67dfd4a57
https://doi.org/10.1109/ectc32696.2021.00331 -
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المؤلفون: Tsuneo Kanda, Yoshihiro Shiode, Ken-ichiro Shinoda
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Wavefront, Materials science, business.industry, Metrology, law.invention, Numerical aperture, Lens (optics), Optics, law, Node (circuits), Photolithography, Photomask, business, Lithography
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::28647d7573507329d0e99681e8d86cba
https://doi.org/10.1117/12.485464