المؤلفون: Verreck, D., Arreghini, A., Schanovsky, F., Rzepa, G., Stanojevic, Z., Mitterbauer, F., Kernstock, C., Baumgartner, O., Karner, M., Van den bosch, G., Rosmeulen, M.

المصدر: 2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :1-4 Dec, 2021

Relation: 2021 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Karner, M., Rzepa, G., Baumgartner, O., Strof, G., Schanovsky, F., Mitterbauer, F., Kernstock, C., Karner, H.W., Stanojevic, Z.

المصدر: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2021 International Conference on. :15-18 Sep, 2021

Relation: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Thesberg, M., Stanojevic, Z., Baumgartner, O., Kernstock, C., Leonelli, D., Barci, M., Wang, X., Zhou, X., Jiao, H., Donadio, G. L., Garbin, D., Witters, T., Kundu, S., Hody, H., Delhougne, R., Kar, G., Karner, M.

المصدر: Solid-State Electronics, Volume 199, January 2023, 108504

مصطلحات موضوعية: Condensed Matter - Mesoscale and Nanoscale Physics, Condensed Matter - Materials Science, Physics - Applied Physics

URL الوصول: http://arxiv.org/abs/2211.06084

المؤلفون: Schanovsky, F., Verreck, D., Arreghini, A., Rzepa, G., Stanojevic, Z., Kernstock, C., Baumgartner, O., Rosmeulen, M., Karner, M.

المصدر: 2021 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2021 IEEE International. :1-4 May, 2021

Relation: 2021 IEEE International Memory Workshop (IMW)

المؤلفون: Rzepa, G., Karner, M., Baumgartner, O., Strof, G., Schanovsky, F., Mitterbauer, F., Kernstock, C., Karner, H.W., Weckx, P., Hellings, G., Claes, D., Wu, Z., Xiang, Y., Chiarella, T., Parvais, B., Mitard, J., Franco, J., Kaczer, B., Linten, D., Stanojevic, Z.

المصدر: 2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-6 Mar, 2021

Relation: 2021 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Stanojevic, Z., Tsai, C., Strof, G., Mitterbauer, F., Baumgartner, O., Kernstock, C., Karner, M.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 68(11):5400-5406 Nov, 2021

المؤلفون: Stanojevic, Z., Strof, G., Schanovsky, F., Steiner, K., Baumgartner, O., Kernstock, C., Karner, M.

المصدر: 2018 48th European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), 2018 48th European. :202-205 Sep, 2018

Relation: ESSDERC 2018 - 48th European Solid-State Device Research Conference (ESSDERC)

المؤلفون: Stanojevic, Z., Baumgartner, O., Schanovsky, F., Strof, G., Kernstock, C., Karner, M., Medina, J. M. Gonzalez, Ruiz, F. G., Godoy, A., Gamiz, F.

المصدر: 2018 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) Ultimate Integration on Silicon (EUROSOI-ULIS), 2018 Joint International EUROSOI Workshop and International Conference on. :1-4 Mar, 2018

Relation: 2018 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)

المؤلفون: Stanojevic, Z., Baumgartner, O., Karner, M., Kernstock, C., Karner, H. W., Demel, H., Strof, G., Mitterbauer, F.

المصدر: 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2017 International Conference on. :245-248 Sep, 2017

Relation: 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Stanojevic, Z., Baumgartner, O., Karner, M., Mitterbauer, F., Demel, H., Kernstock, C.

المصدر: 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) Ultimate Integration on Silicon (EUROSOI-ULIS), 2016 Joint International EUROSOI Workshop and International Conference on. :147-150 Jan, 2016

Relation: 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)