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المؤلفون: Matthias Fettke, Timo Kubsch, Anne Fisch, Mohammed Ziad Baa, Thorsten Teutsch, Tobias Seifert, Mario Baum, Franz Selbmann, Soumya Deep Paul, Frank Roscher, Kerstin Kreyssig, Maik Wiemer, Harald Kuhn
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::82ad26da096d5408604cccfe22334cf9
https://doi.org/10.1109/ectc51906.2022.00229 -
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المؤلفون: Peter Fruehauf, Andreas Weigert, Sven Rzepka, Rainer Dudek, Kerstin Kreyssig, Wolfgang Gruebl, Michael Novak
المصدر: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
مصطلحات موضوعية: Acceleration, Materials science, Test board, business.industry, Soldering, Fatigue testing, Numerical modeling, Structural engineering, business, Reliability (statistics), Finite element method, Term (time)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::eb205e911b410275f2b17571234e263c
https://doi.org/10.1109/itherm.2019.8757318 -
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المؤلفون: Dirk Mayer, Sven Rzepka, Alicja Palczynska, Przemyslaw Jakub Gromala, Florian Schindler-Saefkow, Kerstin Kreyßig, Tobias Melz
المصدر: Applied Mechanics and Materials. 807:45-54
مصطلحات موضوعية: Materials science, Silicon, chemistry, Stress sensor, business.industry, chemistry.chemical_element, Microelectronics, Mechanical engineering, General Medicine, business, Piezoresistive effect, Finite element method, Silicon based
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المؤلفون: Kerstin Kreyssig, Ralf Doering, Rainer Dudek, Bernd Michel
المصدر: 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
مصطلحات موضوعية: Materials science, Creep, Shear (geology), Soldering, Drop (liquid), Shear force, Direct shear test, Temperature cycling, Composite material, Finite element method
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::84ce5fee66baff8d2a86fdfe257315dd
https://doi.org/10.1109/esime.2010.5464570