-
1
المؤلفون: Mauro J. Kobrinsky, Hui Jae Yoo, Michael Christenson, Ram Krishnamurthy, Mark A. Anders, Robert L. Bristol, Giselle Elbaz, Himanshu Kaul, Kevin L. Lin, Brandon Holybee, Miriam Reshotko
المصدر: 2020 IEEE International Electron Devices Meeting (IEDM).
مصطلحات موضوعية: Microprocessor, Interconnection, Materials science, business.industry, law, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, Electrical measurements, business, Capacitance, law.invention, Power (physics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::74fc20d6e3c0de75cff1a4dc8a10dd9b
https://doi.org/10.1109/iedm13553.2020.9371946 -
2
المؤلفون: Tanya T. Kwan, Minh Nguyen, Dirk Zboralski, Anne Schumann, Anne Bredenbeck, Matthias Paschke, Christian Haase, Aileen Hoehne, Ulrich Reineke, Christiane Smerling, Frank Osterkamp, Jim Xiao, Andrew D. Simmons, Thomas C. Harding, Kevin L. Lin
المصدر: Molecular Cancer Therapeutics. 20:LBA032-LBA032
مصطلحات موضوعية: Cancer Research, Oncology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4919ec3ab51e23af228e1117a2d26a58
https://doi.org/10.1158/1535-7163.targ-21-lba032 -
3
المؤلفون: Kevin L. Lin, Kanti Jain
المصدر: IEEE Electron Device Letters. 30:14-17
مصطلحات موضوعية: Microelectromechanical systems, Fabrication, Materials science, Capacitive sensing, Nanotechnology, Photoablation, Integrated circuit, Flexible electronics, Electronic, Optical and Magnetic Materials, law.invention, Sensor array, law, Hardware_INTEGRATEDCIRCUITS, Electrical and Electronic Engineering, Microfabrication
-
4
المؤلفون: James S. Clarke, M. Harmes, Mona Mayeh, Hazel Lang, Hui Jae Yoo, Naskar Sudipto, Seung Hoon Sung, Bojarski Stephanie A, John J. Plombon, Colin T. Carver, Kevin L. Lin, Manish Chandhok, B. Krist, Jasmeet S. Chawla
المصدر: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).
مصطلحات موضوعية: Metal, Electron mean free path, Materials science, Nickel silicide, Electrical resistivity and conductivity, business.industry, visual_art, Metallurgy, visual_art.visual_art_medium, Copper interconnect, Optoelectronics, business, Electromigration
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4f5a53afe92975deba3040bb52431efa
https://doi.org/10.1109/iitc-mam.2015.7325612 -
5
المؤلفون: John J. Plombon, Hui Jae Yoo, Narendra Lakamraju, Colin T. Carver, B. Krist, Rahim Kasim, Kanwal Jit Singh, Tejaswi K. Indukuri, Jasmeet S. Chawla, Kevin L. Lin, James S. Clarke, Mauro J. Kobrinsky, J. Bielefeld, Hazel Lang, Kabir Nafees, M. Harmes, Jessica M. Torres, E. Mays, Jacob Faber, Christopher J. Jezewski, Alan Myers, Ramanan V. Chebiam
المصدر: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).
مصطلحات موضوعية: Materials science, Dielectric strength, business.industry, Electrical engineering, Hardware_PERFORMANCEANDRELIABILITY, Dielectric, Planar capacitor, law.invention, Metal, Capacitor, Film capacitor, Planar, Hardware_GENERAL, law, visual_art, Hardware_INTEGRATEDCIRCUITS, visual_art.visual_art_medium, Optoelectronics, Thin film, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e47dcd35f8378b2ae8fafb82d3251683
https://doi.org/10.1109/iitc-mam.2015.7325646 -
6
المؤلفون: Tejaswi K. Indukuri, John J. Plombon, Alan Myers, Mauro J. Kobrinsky, Narendra Lakamraju, Kevin L. Lin, Kanwal Jit Singh, Hui Jae Yoo, Jacob Faber, Christopher J. Jezewski, M. Harmes, B. Krist, James S. Clarke, Ramanan V. Chebiam, Hazel Lang, Colin T. Carver
المصدر: IEEE International Interconnect Technology Conference.
مصطلحات موضوعية: Tantalum capacitor, Materials science, Fabrication, business.industry, Tantalum, chemistry.chemical_element, Time-dependent gate oxide breakdown, Dielectric, Copper, law.invention, Capacitor, chemistry, law, Electronic engineering, Optoelectronics, Thin film, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0d852e28e02fd964aa62b39c06b337a2
https://doi.org/10.1109/iitc.2014.6831864 -
7
المؤلفون: Kevin L. Lin, Martin D. F. Wong, Leslie K. Hwang
المصدر: ISQED
مصطلحات موضوعية: Packaging engineering, Through-silicon via, Computer science, business.industry, Thermal resistance, Three-dimensional integrated circuit, Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit, law.invention, law, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Integrated circuit packaging, Physical design, Routing (electronic design automation), business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fba1c8eedf54818758d45bd1caf96d7f
https://doi.org/10.1109/isqed.2012.6187481 -
8
المؤلفون: Kevin L. Lin, Kanti Jain
المصدر: 2010 IEEE Sensors.
مصطلحات موضوعية: Materials science, Excimer laser, business.industry, medicine.medical_treatment, Capacitive sensing, Photoablation, Nanotechnology, Pressure sensor, Flexible electronics, medicine, Optoelectronics, Microelectronics, Structural health monitoring, Photomask, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::abbae37c326b76591f77431e898af274
https://doi.org/10.1109/icsens.2010.5690817 -
9
المؤلفون: Kanti Jain, Kevin L. Lin
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Microelectromechanical systems, Materials science, Fabrication, Sensor array, Hardware_INTEGRATEDCIRCUITS, Photoablation, Nanotechnology, Electronics, Conformable matrix, Flexible electronics, Microfabrication
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cc5f575289036ac6d59761f1a00e800c
https://doi.org/10.1117/12.809235