يعرض 1 - 10 نتائج من 76 نتيجة بحث عن '"Khatibi, Golta"', وقت الاستعلام: 0.84s تنقيح النتائج
  1. 1
    مؤتمر
    Iron Nanoparticle-Doped Flux: Wetting Characteristics of Flux and SAC305 Solder and Effects on Flux Viscosity

    المؤلفون: Wodak, Irina, Khatibi, Golta, Yakymovych, Andriy, Krammer, Oliver, Geczy, Attila

    المصدر: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-5 May, 2024

    Relation: 2024 47th International Spring Seminar on Electronics Technology (ISSE)

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  2. 2
    مؤتمر
    Adhesion measurements of Polyimide to silicon nitride for semiconductor component applications

    المؤلفون: Hartleb, Moritz, Imrich, Peter, Zechner, Johannes, Walter, Thomas, Khatibi, Golta

    المصدر: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-5 May, 2024

    Relation: 2024 47th International Spring Seminar on Electronics Technology (ISSE)

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  3. 3
    مؤتمر
    Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-based Solders with nano-sized Fe doped Flux

    المؤلفون: Wodak, Irina, Yakymovych, Andriy, Khatibi, Golta

    المصدر: 2023 46th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2023 46th International Spring Seminar on. :1-4 May, 2023

    Relation: 2023 46th International Spring Seminar on Electronics Technology (ISSE)

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  4. 4
    مؤتمر
    Cross-sectional Nanoindentation: Applicability for testing Polyimide adhesion in semiconductor components

    المؤلفون: Hartleb, Moritz, Imrich, Peter, Zechner, Johannes, Walter, Thomas, Khatibi, Golta

    المصدر: 2023 46th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2023 46th International Spring Seminar on. :1-5 May, 2023

    Relation: 2023 46th International Spring Seminar on Electronics Technology (ISSE)

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  5. 5
    مؤتمر
    Temperature Dependent Relaxation Behavior of Ag-Sintered Copper Joints

    المؤلفون: Gokdeniz, Zeynep Gokce, Lederer, Martin, Khatibi, Golta, Nicolics, Johann

    المصدر: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2021 23rd European. :1-5 Sep, 2021

    Relation: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

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  6. 6
    مؤتمر
    Temperature Dependent Relaxation Behavior of Pressureless and Pressure Assisted Sintered Silver

    المؤلفون: Gokce Gokdeniz, Zeynep, Lederer, Martin, Khatibi, Golta, Nicolics, Johann

    المصدر: 2021 44th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2021 44th International Spring Seminar on. :1-6 May, 2021

    Relation: 2021 44th International Spring Seminar on Electronics Technology (ISSE)

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  7. 7
    دورية أكاديمية
    Hybrid solder joints: the effect of nanosized ZrO2 particles on morphology of as-reflowed and thermally aged Sn–3.5Ag solder joints

    المؤلفون: Wodak, Irina, Yakymovych, AndriyAff1, IDs13204023029124_cor2, Svec, Sr., Peter, Orovcik, Lubomir, Khatibi, GoltaAff1, Aff2

    المصدر: Applied Nanoscience. 13(11):7379-7385

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  8. 8
    مؤتمر
    Application of in-situ non-invasive failure detection methods for wire bonds

    المؤلفون: Czerny, Bernhard, Chavan, Vinayak, Gasser, Christoph, Rosc, Jordis, Khatibi, Golta

    المصدر: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2020 IEEE 8th. :1-6 Sep, 2020

    Relation: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

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  9. 9
    مؤتمر
    Temperature Dependent Physical Properties of Sintered Silver Layers for Power Electronics

    المؤلفون: gokdeniz, Zeynep gokce, Khatibi, Golta, Gierl-Mayer, Christian, Steiger-Thirsfeld, Andreas, Mundlein, Martin

    المصدر: 2020 43rd International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2020 43rd International Spring Seminar on. :1-8 May, 2020

    Relation: 2020 43rd International Spring Seminar on Electronics Technology (ISSE)

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  10. 10
    دورية أكاديمية
    Nano-scale mechanistic model for microstructural reliability in reactive hybrid solder joints

    المؤلفون: Khodabakhshi, Farzad, Wodak, Irina, Yakymovych, Andriy, Taheriniya, Shabnam, Khademorezaian, Saba, Wilde, Gerhard, Khatibi, Golta

    المصدر: In Materials Characterization October 2024 216

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