يعرض 1 - 10 نتائج من 24 نتيجة بحث عن '"Khim, JinYoung"', وقت الاستعلام: 1.08s تنقيح النتائج
  1. 1
    مؤتمر
    Reliability Performance of S-Connect Module (Bridge Technology) for Heterogeneous Integration Packaging

    المؤلفون: Jang, Heejun, Ahn, Kyun, Park, Haesung, Yong, Gamhan, Kim, Jihyun, Jeong, YeonKi, Sohn, EunSook, Hiner, Dave, Kelly, Mike, Hwang, Taekyeong, Do, Wonchul, Khim, JinYoung

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1027-1031 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Electromigration Performance of Fine-Line Cu Redistribution Layer (RDL) for High-Density Fan-Out Packaging

    المؤلفون: Kwon, JiHye, Ju, JeongMin, Kim, SangHyuk, Sohn, EunSook, Khim, JinYoung

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1297-1302 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    High Performance Multi-Chip Leadframe Package with Internal Connection

    المؤلفون: Park, DaeYoung, Jeon, HyeongIl, Kim, GiJeong, Yang, JiYeon, Sang, KwangSoo, Kim, ByongJin, Khim, JinYoung

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :160-164 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  4. 4
    مؤتمر
    Next Gen Laser Assisted Bonding (LAB) Technology

    المؤلفون: Na, SeokHo, Gim, MinHo, Kim, ChoongHoe, Park, DongHyeon, Ryu, DongSu, Park, DongJoo, Khim, JinYoung

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1991-1995 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    A Hybrid Panel Level Package (Hybrid PLP) Technology Based on a 650-mm x 650-mm Platform

    المؤلفون: O'Toole, Eoin, Silva, Jose Luis, Cardoso, Filipe, Silva, Jose, Alves, Luis, Souto, Marcio, Delduque, Nuno, Coelho, Anibal, Silva, Jose Miguel, Do, WonChul, Khim, JinYoung

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :824-827 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    Thermal Performance of Advanced TIMs for High-Power FCLBGAs

    المؤلفون: Koh, YoungJoon, Kim, SangHyuk, Sohn, EunSook, Khim, JinYoung

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1249-1255 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Substrate Silicon Wafer Integrated Fan-out Technology (S-SWIFT®) Packaging with Fine Pitch Embedded Trace RDL

    المؤلفون: Jin, SangHyun, Do, WonChul, Jeong, JinSuk, Cha, HyunGoo, Jeong, YunKyung, Khim, JinYoung

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1355-1361 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    Chip-Last HDFO (High-Density Fan-Out) Interposer-PoP

    المؤلفون: Kim, JaeYoon, Kim, KyeRyung, Lee, EunYoung, Hong, SeHwan, Kim, JiHyun, Ryu, JiYeon, Lee, JiHun, Hiner, David, Do, WonChul, Khim, JinYoung

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :56-61 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    S-Connect Fan-out Interposer For Next Gen Heterogeneous Integration

    المؤلفون: Lee, JiHun, Yong, GamHan, Jeong, MinSu, Jeon, JongHyun, Han, DongHoon, Lee, MinKeon, Do, WonChul, Sohn, EunSook, Kelly, Mike, Hiner, Dave, Khim, JinYoung

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :96-100 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  10. 10
    مؤتمر
    Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4th Industrial Revolution Era

    المؤلفون: Choi, MiKyeong, Jung, HyunHye, Oh, KwangSeok, Ryu, DongSu, Lee, SangHyoun, Do, WonChul, Kweon, YoungDo, Kelly, Mike, Park, KyungRok, Khim, JinYoung, Huemoeller, Ron

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1332-1337 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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