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1مؤتمر
المؤلفون: Ki-Jun Sung, Kwang-Seong Choi, Byeong-Ok Lim, Hyun-Cheol Bae, Sun-Woo Choo, Jong-Tae Moon, Yong Hwan Kwon, Eun Soo Nam, Yong-Sung Eom
المصدر: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on. :185-189 Aug, 2010
Relation: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
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2مؤتمر
المؤلفون: Choi, Kwang-Seong, Sun-Woo Choo, Jong-Jin Lee, Ki-Jun Sung, Hyun-Chel Bae, Byeong-Ok Lim, Jong-Tae Moon, Eom, Yong-Sung
المصدر: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on. :805-809 Aug, 2010
Relation: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
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3
المؤلفون: Ki-Jun Sung, Kyoungtae Eun, Seowon Lee, Sungwon Yoon, Ho-Young Son, Kang-Wook Lee
المصدر: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::29e378a873580b6812140ee0419102c7
https://doi.org/10.1109/edtm55494.2023.10102966 -
4
المؤلفون: Ho-Young Son, Ki-Jun Sung, Bok-Kyu Choi, Jong-Hoon Kim, Kangwook Lee
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1f4d0a52634faac92ee9f5c9011c6ac7
https://doi.org/10.1109/ectc51906.2022.00217 -
5
المؤلفون: Ki-Jun Sung, Yong-Sung Eom, Yong-Hwan Kwon, Hyun-Cheol Bae, Kwang-Seong Choi
المصدر: ETRI Journal. 34:706-712
مصطلحات موضوعية: Materials science, General Computer Science, Through-silicon via, Metallurgy, Stacking, Three-dimensional integrated circuit, Integrated circuit, Chip, Electronic, Optical and Magnetic Materials, law.invention, law, Soldering, Bumping, Electrical and Electronic Engineering, Composite material, Flip chip
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6
المؤلفون: Yong-Sung Eom, Kwang-Seong Choi, Jong-Jin Lee, Hyun-Cheol Bae, Ki-Jun Sung, Jong-Tae Moon, Byeong-Ok Lim, Sun-Woo Chu
المصدر: ETRI Journal. 33:637-640
مصطلحات موضوعية: Materials science, General Computer Science, Metallurgy, Solder paste, Epoxy, Electronic, Optical and Magnetic Materials, Substrate (building), visual_art, Soldering, visual_art.visual_art_medium, Bumping, Wetting, Electrical and Electronic Engineering, Layer (electronics), Flip chip
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7
المؤلفون: Ki-Jun Sung, Sunghae Jung, Byeong-Ok Lim, Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, Jong-Tae Moon
المصدر: ETRI Journal. 32:342-344
مصطلحات موضوعية: Coalescence (physics), Materials science, General Computer Science, Metallurgy, Oxide, Solder paste, Electronic, Optical and Magnetic Materials, Outgassing, chemistry.chemical_compound, chemistry, Soldering, Bumping, Wetting, Electrical and Electronic Engineering, Layer (electronics)
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8
المؤلفون: Ki-Jun Sung, Hyun-Cheol Bae, Kwang-Seong Choi, Yong-Sung Eom, Jong-Tae Moon
المصدر: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, Wafer bonding, Soldering, Metallurgy, Stacking, Three-dimensional integrated circuit, SMT placement equipment, Bumping, Wafer, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4c41ad516e14218fcb1969a15dac02b0
https://doi.org/10.1109/ectc.2011.5898748 -
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المؤلفون: Byeong-Ok Lim, Ki-Jun Sung, Sun-Woo Choo, Hyun-Chel Bae, Yong-Sung Eom, Kwang-Seong Choi, Jong-Jin Lee, Jong-Tae Moon
المصدر: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
مصطلحات موضوعية: Materials science, Reliability (semiconductor), business.industry, Soldering, Optoelectronics, Fine pitch, Bumping, Composite material, business, Flip chip, Design for manufacturability
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0f550fddb7fb1fb9df99d49ffb3d1992
https://doi.org/10.1109/icept.2010.5582689 -
10
المؤلفون: Ki-Jun Sung, Yong-Sung Eom, Hyun-Cheol Bae, Byeung-Gee Kim, Sunghae Jung, Jong-Tae Moon, Byeong-Ok Lim, In-Soo Kang, Kwang-Seong Choi
المصدر: 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: chemistry.chemical_classification, System in package, Materials science, Silicon, chemistry, Soldering, Electrode, Interposer, chemistry.chemical_element, Solder paste, Polymer, Composite material, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::49e2a7a79f0b1d99b808f92cef23f41a
https://doi.org/10.1109/ectc.2010.5490765
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