المؤلفون: Fujino, Masahisa, Takahashi, Kenji, Kikuchi, Katsuya, Miyata, Noboru

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :97-98 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Watanabe, Naoya, Araga, Yuuki, Shimamoto, Haruo, Nagata, Makoto, Kikuchi, Katsuya

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1792-1797 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Kikuchi, Katsuya

المصدر: 2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK) Future of Electron Devices, Kansai (IMFEDK), 2022 IEEE International Meeting for. :1-4 Nov, 2022

Relation: 2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)

المؤلفون: Zhao, Zhijan, Toda, Masaya, Ono, Takahito, Hara, Motoaki, Shinada, Satoshi, Nakagawa, Hiroshi, Kikuchi, Katsuya

المصدر: 2022 Smart Systems Integration (SSI) Smart Systems Integration (SSI), 2022. :1-4 Apr, 2022

Relation: 2022 Smart Systems Integration (SSI)

المؤلفون: Miki, Takuji, Nagata, Makoto, Sonoda, Hiroki, Miura, Noriyuki, Okidono, Takaaki, Araga, Yuuki, Watanabe, Naoya, Shimamoto, Haruo, Kikuchi, Katsuya

المصدر: 2019 IEEE Asian Solid-State Circuits Conference (A-SSCC) Asian Solid-State Circuits Conference (A-SSCC), 2019 IEEE. :25-28 Nov, 2019

Relation: 2019 IEEE Asian Solid-State Circuits Conference (A-SSCC)

المؤلفون: Feng, Wei, Watanabe, Naoya, Shimamoto, Haruo, Aoyagi, Masahiro, Kikuchi, Katsuya

المصدر: 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-4 Oct, 2019

Relation: 2019 International 3D Systems Integration Conference (3DIC)

المؤلفون: Miki, Takuji, Nagata, Makoto, Tsukioka, Akihiro, Miura, Noriyuki, Okidono, Takaaki, Araga, Yuuki, Watanabe, Naoya, Shimamoto, Haruo, Kikuchi, Katsuya

المصدر: 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-4 Oct, 2019

Relation: 2019 International 3D Systems Integration Conference (3DIC)

المؤلفون: Sonoda, Hiroki, Nagata, Makoto, Tanaka, Daisuke, Murakami, Yoshihide, Mihara, Kyoshi, Makida, Kazuo, Kikuchi, Katsuya

المصدر: 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2019 12th International Workshop on the. :216-218 Oct, 2019

Relation: 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)

المؤلفون: Nemoto, Shunsuke, Maeda, Takehiko, Miyajima, Masahiro, Akaike, Yasuhiko, Kitagawa, Katsuhiko, Ishii, Hideki, Shimamoto, Haruo, Kikuchi, Katsuya

المصدر: 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :56-60 Apr, 2019

Relation: 2019 International Conference on Electronics Packaging (ICEP)

المؤلفون: Yakushiji, Kay, Takagi, Hideki, Watanabe, Naoya, Fukushima, Akio, Kikuchi, Katsuya, Kurashima, Yuichi, Sugihara, Atsushi, Kubota, Hitoshi, Yuasa, Shinji

المصدر: 2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021

Relation: 2021 Symposium on VLSI Technology