يعرض 1 - 10 نتائج من 203 نتيجة بحث عن '"Kim, Byung-Cheol"', وقت الاستعلام: 0.81s تنقيح النتائج
  1. 1
    تقرير
    Enhancing Empathy in Virtual Reality: An Embodied Approach to Mindset Modulation

    المؤلفون: Bae, Seoyeon, Lee, Yoon Kyung, Lee, Jungcheol, Kim, Jaeheon, Jeon, Haeseong, Lim, Seung-Hwan, Kim, Byung-Cheol, Hahn, Sowon

    مصطلحات موضوعية: Computer Science - Human-Computer Interaction

    URL الوصول: http://arxiv.org/abs/2404.00300

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  2. 2
    مؤتمر
    6-Sided Die Protection for Chiplet Package with Multi-Layer RDL

    المؤلفون: Kim, Byung-Cheol, Melgo, Mary Maye, Gacho, Rizi, Oh, Kwang-Sun, Lim, Jacinta Aman, Sandstrom, Cliff

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1566-1570 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Component Level Reliability Evaluation of Low Cost 6-Sided Die Protection versus Wafer Level Chip Scale Packaging with 350um Ball Pitch

    المؤلفون: Lim, Jacinta Aman, Kim, Byung-Cheol, Valencia-Gacho, Rizi, Dunlap, Brett

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1791-1797 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Package Reliability Evaluation of 600mm FOPLP with 6-Sided Die Protection with 0.35mm Ball Pitch

    المؤلفون: Lim, Jacinta Aman, Dunlap, Brett, Hong, Sungeun, Shin, Hyung-Jin, Kim, Byung-Cheol

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :828-835 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    600mm Fan-Out Panel Level Packaging (FOPLP) As A Scale Up Alternative to 300mm Fan-Out Wafer Level Packaging (FOWLP) with 6-Sided Die Protection

    المؤلفون: Lim, Jacinta Aman, Park, Yun-Mook, De Vera, Edil, Kim, Byung-Cheol, Dunlap, Brett

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1063-1069 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    600MM Wafer-Level Fan Out on Panel Level Processing with 6-Sided Die Protection

    المؤلفون: Lim, Jacinta Aman, Park, YunMook, Kim, Byung Cheol, Devera, Edil

    المصدر: 2020 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2020 International. :1-8 Oct, 2020

    Relation: 2020 International Wafer Level Packaging Conference (IWLPC)

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  7. 7
    مؤتمر
    25.2 A 16Gb Sub-1V 7.14Gb/s/pin LPDDR5 SDRAM Applying a Mosaic Architecture with a Short-Feedback 1-Tap DFE, an FSS Bus with Low-Level Swing and an Adaptively Controlled Body Biasing in a 3rd-Generation 10nm DRAM

    المؤلفون: Kim, Yong-Hun, Kim, Hyung-Jin, Choi, Jaemin, Ahn, Min-Su, Lee, Dongkeon, Cho, Seung-Hyun, Park, Dong-Yeon, Park, Young-Jae, Jang, Min-Soo, Kim, Yong-Jun, Choi, Jinyong, Yoon, Sung-Woo, Jung, Jae-Woo, Park, Jae-Koo, Lee, Jae-Woo, Kwon, Dae-Hyun, Cha, Hyung-Seok, Cho, Si-Hyeong, Kim, Seong-Hoon, You, Jihwa, Kim, Kyoung-Ho, Kim, Dae-Hyun, Kim, Byung-Cheol, Kim, Young-Kwan, Kim, Jun-Ho, Choi, Seouk-Kyu, Kim, Chan-Young, Na, Byong-Wook, Choi, Hye-In, Oh, Reum, Ihm, Jeong-Don, Bae, Seung-Jun, Kim, Nam Sung, Lee, Jung-Bae

    المصدر: 2021 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2021 IEEE International. 64:346-348 Feb, 2021

    Relation: 2021 IEEE International Solid-State Circuits Conference (ISSCC)

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  8. 8
    دورية أكاديمية
    Multi-factor dependence modelling with specified marginals and structured association in large-scale project risk assessment

    المؤلفون: Kim, Byung-Cheol

    المصدر: In European Journal of Operational Research 16 January 2022 296(2):679-695

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  9. 9
    دورية أكاديمية
    Double Marginalization and Misplacement in Online Advertising.

    المؤلفون: White, Alexander, Jain, Kamal, Ichihashi, Shota, Kim, Byung‐Cheol

    المصدر: Journal of Industrial Economics; Jun2024, Vol. 72 Issue 2, p940-964, 25p

    مصطلحات موضوعية: INTERNET advertising, INTERNET users, WEBSITES

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  10. 10
    دورية أكاديمية
    The utilitarian–maximin social welfare function and anomalies in social choice

    المؤلفون: Schneider, Mark, Kim, Byung-Cheol

    المصدر: Southern Economic Journal, 2020 Oct 01. 87(2), 629-646.

    URL الوصول: https://www.jstor.org/stable/26968407

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