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1مؤتمر
المؤلفون: Kim, Da-Hee, Lee, Jae-Ean, Choi, Gyujin, Lee, Sunguk, Jeong, Giho, Kim, Hongwon, Lee, Seokwon, Kim, Dong Wook
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :819-823 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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2دورية أكاديمية
المؤلفون: Kim, HongwonAff1, Aff2, Lee, Yoo-Jung, Kwon, Youngeun, Kim, JongpilAff1, IDs41598023486558_cor4
المصدر: Scientific Reports. 13(1)
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3دورية أكاديمية
المؤلفون: Park, Hanseul, Cho, Byounggook, Kim, Hongwon, Saito, TakashiAff2, Aff3, Saido, Takaomi C., Won, Kyoung-JaeAff4, IDs41467023365198_cor6, Kim, JongpilAff1, IDs41467023365198_cor7
المصدر: Nature Communications. 14(1)
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4دورية أكاديمية
المؤلفون: Hwang, In-Jun, Choi, Chanhee, Kim, Hongwon, Lee, Hyunji, Yoo, Yejoo, Choi, Yujin, Hwang, Jin-Hyeok, Jung, Kwangrok, Lee, Jong-Chan, Kim, Jong-Ho
المصدر: In Biosensors and Bioelectronics 15 March 2024 248
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5دورية أكاديمية
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6دورية أكاديمية
المؤلفون: So, Yoonhee, Yim, DaBin, Lee, Sin, Lee, Hyunji, Kim, Hongwon, Yu, Yejoo, Choi, Chanhee, Kim, Jong-Ho
المصدر: In Chemical Engineering Journal 15 July 2023 468
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7دورية أكاديمية
المؤلفون: Kim, Hongwon, Cho, Byounggook, Park, Hanseul, Kim, Junyeop, Kim, Siyoung, Shin, Jaein, Lengner, Christopher J., Won, Kyoung-JaeAff3, IDs41380022015631_cor8, Kim, JongpilAff1, IDs41380022015631_cor9
المصدر: Molecular Psychiatry. 27(6):2751-2765
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8دورية أكاديمية
المؤلفون: Kim, HongwonAff1, Aff2, Kim, Siyoung, Cho, Byounggook, Shin, Jaein, Kim, JongpilAff1, Aff2, IDs40035022003199_cor5
المصدر: Translational Neurodegeneration. 11(1)
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9مؤتمر
المؤلفون: Kim, KyungO, Kim, Taeeui, Kim, Hongwon, Lee, Dongwhan, Yi, Sung
المصدر: 2008 38th European Microwave Conference Microwave Conference, 2008. EuMC 2008. 38th European. :32-35 Oct, 2008
Relation: 2008 38th European Microwave Conference (EuMC)
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10مؤتمر
المؤلفون: Kim, Taeeui, Kim, KyungO, Kim, Hongwon, Jung, Taesung, Yi, Sung
المصدر: 2008 International Conference on Electronic Materials and Packaging Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on. :317-320 Oct, 2008
Relation: 2008 International Conference on Electronic Materials and Packaging (EMAP)