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1مؤتمر
المؤلفون: Gao, BoYu, Zheng, Haojun, Zhao, Jingbo, Tu, Huawei, Kim, HyungSeok, Duh, Henry Been-Lirn
المصدر: 2024 IEEE Conference Virtual Reality and 3D User Interfaces (VR) VR Virtual Reality and 3D User Interfaces (VR), 2024 IEEE Conference. :1054-1064 Mar, 2024
Relation: 2024 IEEE Conference Virtual Reality and 3D User Interfaces (VR)
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2تقرير
المؤلفون: Kim, Hyungseok, Kim, Soobin, Morris, Megan M., Kimbrel, Jeffrey A., Mayali, Xavier, Buie, Cullen R.
مصطلحات موضوعية: Statistics - Applications, Quantitative Biology - Populations and Evolution
URL الوصول: http://arxiv.org/abs/2308.00354
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3مؤتمر
المؤلفون: Kim, Hyungseok, Lee, Junoh, Kim, Soomin, Jung, Seungil, Cha, Sang Kil
المصدر: 2022 52nd Annual IEEE/IFIP International Conference on Dependable Systems and Networks (DSN) DSN Dependable Systems and Networks (DSN), 2022 52nd Annual IEEE/IFIP International Conference on. :559-566 Jun, 2022
Relation: 2022 52nd Annual IEEE/IFIP International Conference on Dependable Systems and Networks (DSN)
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4مؤتمر
المؤلفون: Han, Ju Hee, Kim, Jee-In, Kim, Hyungseok, Suh, Jang Won
المصدر: 2021 IEEE International Conference on Big Data and Smart Computing (BigComp) BIGCOMP Big Data and Smart Computing (BigComp), 2021 IEEE International Conference on. :114-120 Jan, 2021
Relation: 2021 IEEE International Conference on Big Data and Smart Computing (BigComp)
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5مؤتمر
المؤلفون: Zhang, Guofeng, Kim, HyungSeok, Liu, Yue
المصدر: 2022 IEEE International Symposium on Mixed and Augmented Reality Adjunct (ISMAR-Adjunct) ISMAR-ADJUNCT Mixed and Augmented Reality Adjunct (ISMAR-Adjunct), 2022 IEEE International Symposium on. :xvii-xvii Oct, 2022
Relation: 2022 IEEE International Symposium on Mixed and Augmented Reality Adjunct (ISMAR-Adjunct)
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6دورية أكاديمية
المؤلفون: Kim, Kang Hyeon, Yoo, Yong Kyoung, Lee, Na EunAff1, Aff4, Lee, Junwoo, Kim, Cheonjung, Lee, SeungminAff1, Aff3, Kim, Jinhwan, Park, Seong Jun, Lee, Dongtak, Lee, Sang WonAff3, Aff5, Kim, Hyungseok, Hur, Don, Yoon, Dae SungAff3, IDs1320602300109z_cor13, Lee, Jeong HoonAff1, IDs1320602300109z_cor14
المصدر: BioChip Journal. 17(3):340-348
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7دورية أكاديمية
المؤلفون: Kim, Hyungseok, You, DonghyunAff1, Aff2, IDs11663023028028_cor2
المصدر: Metallurgical and Materials Transactions B: Process metallurgy and materials processing science. 54(4):1886-1899
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8دورية أكاديميةAutomatic 3D Facial Landmark-Based Deformation Transfer on Facial Variants for Blendshape Generation
المؤلفون: Ingale, Anupama K., Leema, A. AnnyAff1, Aff4, IDs13369022074032_cor2, kim, HyungSeok, Udayan, J. Divya
المصدر: Arabian Journal for Science and Engineering. 48(8):10109-10123
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9مؤتمر
المؤلفون: Lee, Jun, Kim, Jee-In, Kim, HyungSeok
المصدر: 2019 IEEE International Conference on Big Data and Smart Computing (BigComp) Big Data and Smart Computing (BigComp), 2019 IEEE International Conference on. :1-8 Feb, 2019
Relation: 2019 IEEE International Conference on Big Data and Smart Computing (BigComp)
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10دورية أكاديمية
المؤلفون: Kim, Jeenam, Seo, Chaneol, Yoo, Jung Hwan, Choi, Seung Hoon, Ko, Kwang Yeon, Choi, Hyung Jin, Lee, Ki Hyun, Choi, Hyungon, Shin, Donghyeok, Kim, HyungSeokAff2, IDs41598023280567_cor10, Lee, Myung Chul
المصدر: Scientific Reports. 13(1)