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1مؤتمرSignal Integrity Analysis and Design for Cascaded Wire Bonding of Low-Power Double Data Rate (LPDDR)
المؤلفون: Ryu, Seunghun, Kim, Hyunwoong, Park, Gagyeong, Lee, Seonghi, Park, Dongryul, Lee, Sanguk, Rhee, Jaewon, Kim, Jongwook, Ahn, Seungyoung
المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :221-224 May, 2024
Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)
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2مؤتمر
المؤلفون: Kim, Hyunwoong, Lee, Seonghi, Ahn, Seungyoung
المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :176-179 May, 2024
Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)
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3مؤتمر
المؤلفون: Park, Dongryul, Ryu, Seunghun, Kim, Hyunwoong, Lee, Seonghi, Song, Sangsub, Yong, Seokbeom, Ahn, Seungyoung
المصدر: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2023 IEEE Electrical Design of. :1-3 Dec, 2023
Relation: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
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4مؤتمر
المؤلفون: Kim, Hyunwoong, Lee, Seonghi, Park, Dongryul, Son, Jungil, Lee, Yongho, Moon, Sungwook, Kim, Jiseong, Ahn, Seungyoung
المصدر: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2023 IEEE Electrical Design of. :1-3 Dec, 2023
Relation: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
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5مؤتمر
المؤلفون: Lee, Seonghi, Kim, Hyunwoong, Park, Jiyoung, Lee, Youngho, Moon, Sungwook, Ahn, Seungyoung
المصدر: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023 IEEE Symposium on. :147-152 Jul, 2023
Relation: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
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6مؤتمر
المؤلفون: Kim, Hyunwoong, Lee, Sanguk, Joung, Jong-Man, Park, Bumjin, Ahn, Seungyoung
المصدر: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023 IEEE Symposium on. :191-195 Jul, 2023
Relation: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
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7مؤتمر
المؤلفون: Rhee, Jaewon, Kim, Hyunwoong, Chu, Kwanguk, Ahn, Seungyoung
المصدر: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023 IEEE Symposium on. :443-447 Jul, 2023
Relation: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
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8مؤتمر
المؤلفون: Ryu, Seunghun, Kim, Hyunwoong, Lee, Seonghi, Park, Dongryul, Lee, Sanguk, Ahn, Seungyoung
المصدر: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023 IEEE Symposium on. :131-136 Jul, 2023
Relation: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
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9مؤتمر
المؤلفون: Kim, Hyunwoong, Park, Gagyeong, Ryu, Seunghun, Kim, Jongwook, Lee, Jaehoon, Ahn, Seungyoung
المصدر: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023 IEEE Symposium on. :141-146 Jul, 2023
Relation: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
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10مؤتمر
المؤلفون: Lee, Seonghi, Kim, Hyunwoong, Park, Dongryul, Ahn, Jangyong, Ryu, Seunghun, Park, Gagyeong, Ahn, Seungyoung
المصدر: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2022 IEEE Electrical Design of. :1-3 Dec, 2022
Relation: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)