يعرض 1 - 10 نتائج من 80 نتيجة بحث عن '"Kim, Hyunwoong"', وقت الاستعلام: 1.14s تنقيح النتائج
  1. 1
    مؤتمر
    Signal Integrity Analysis and Design for Cascaded Wire Bonding of Low-Power Double Data Rate (LPDDR)

    المؤلفون: Ryu, Seunghun, Kim, Hyunwoong, Park, Gagyeong, Lee, Seonghi, Park, Dongryul, Lee, Sanguk, Rhee, Jaewon, Kim, Jongwook, Ahn, Seungyoung

    المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :221-224 May, 2024

    Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)

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  2. 2
    مؤتمر
    Design Methodology of Through-Silicon via for Crosstalk Optimization Based on Impedance

    المؤلفون: Kim, Hyunwoong, Lee, Seonghi, Ahn, Seungyoung

    المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :176-179 May, 2024

    Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)

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  3. 3
    مؤتمر
    3D-IC Power Distribution Network (PDN) Impedance Prediction using Deep Learning (DL)

    المؤلفون: Park, Dongryul, Ryu, Seunghun, Kim, Hyunwoong, Lee, Seonghi, Song, Sangsub, Yong, Seokbeom, Ahn, Seungyoung

    المصدر: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2023 IEEE Electrical Design of. :1-3 Dec, 2023

    Relation: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

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  4. 4
    مؤتمر
    Power Integrity Design of Mobile 3D-IC Based on the Allocation of Optimal Number of TSV, BGA, and Via

    المؤلفون: Kim, Hyunwoong, Lee, Seonghi, Park, Dongryul, Son, Jungil, Lee, Yongho, Moon, Sungwook, Kim, Jiseong, Ahn, Seungyoung

    المصدر: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2023 IEEE Electrical Design of. :1-3 Dec, 2023

    Relation: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

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  5. 5
    مؤتمر
    Design and Analysis of Double-side Characteristic Impedance Compensation Structure in 2.5D / 3D Package for High-speed Serial Link

    المؤلفون: Lee, Seonghi, Kim, Hyunwoong, Park, Jiyoung, Lee, Youngho, Moon, Sungwook, Ahn, Seungyoung

    المصدر: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023 IEEE Symposium on. :147-152 Jul, 2023

    Relation: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)

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  6. 6
    مؤتمر
    Analysis of Methodology of Breakpoint Detection Method for 22.9kV Submarine Power cable based on the Time Domain Reflectometer (TDR)

    المؤلفون: Kim, Hyunwoong, Lee, Sanguk, Joung, Jong-Man, Park, Bumjin, Ahn, Seungyoung

    المصدر: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023 IEEE Symposium on. :191-195 Jul, 2023

    Relation: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)

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  7. 7
    مؤتمر
    Noise Source Impedance Extraction Method of Switched-Mode Power Supply (SMPS) in PC According to the Frequency Range

    المؤلفون: Rhee, Jaewon, Kim, Hyunwoong, Chu, Kwanguk, Ahn, Seungyoung

    المصدر: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023 IEEE Symposium on. :443-447 Jul, 2023

    Relation: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)

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  8. 8
    مؤتمر
    Signal Integrity Analysis of Notch-Routing to Reduce Near-End Crosstalk for Tightly Coupled and Short Microstrip Channel

    المؤلفون: Ryu, Seunghun, Kim, Hyunwoong, Lee, Seonghi, Park, Dongryul, Lee, Sanguk, Ahn, Seungyoung

    المصدر: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023 IEEE Symposium on. :131-136 Jul, 2023

    Relation: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)

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  9. 9
    مؤتمر
    Signal Integrity Analysis of Wire Bonding Finger Capacitance to Reduce the Reflection of Multi-drop Topology for Low-Power Double Data Rate (LPDDR)

    المؤلفون: Kim, Hyunwoong, Park, Gagyeong, Ryu, Seunghun, Kim, Jongwook, Lee, Jaehoon, Ahn, Seungyoung

    المصدر: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023 IEEE Symposium on. :141-146 Jul, 2023

    Relation: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)

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  10. 10
    مؤتمر
    Deep Reinforcement Learning-based Decoupling Capacitor Optimization Method for Multi-Power Domain considering Transfer Noise in 3D-ICs

    المؤلفون: Lee, Seonghi, Kim, Hyunwoong, Park, Dongryul, Ahn, Jangyong, Ryu, Seunghun, Park, Gagyeong, Ahn, Seungyoung

    المصدر: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2022 IEEE Electrical Design of. :1-3 Dec, 2022

    Relation: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

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