المؤلفون: Son, Kihwang, Park, Seulki, Jung, Kyunghoon, Kim, Jun-Gyu, Ko, Younggun, Cheon, Keonyong, Yoon, Changkeun, Kim, Jiho, Jeong, Jaehun, Myung, Taehun, Hong, Changmin, Jang, Weonwi, Sun, Min-Chul, Jo, Sungil, Kim, Ju-Youn, Song, Byungmoo, Yasuda-Masuoka, Yuri, Ku, Ja-Hum, Jeong, Gitae

المصدر: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023

Relation: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

المؤلفون: Kim, BaekGyu, Song, Jin Yeong, Kim, Do Young, Kim, Jun Gyu, Lee, Jun-Yeop, Choi, Dongwhi^{Aff2, IDs40684023005138_cor6}, Park, Sang Min^{Aff1, IDs40684023005138_cor7}

المصدر: International Journal of Precision Engineering and Manufacturing-Green Technology. 10(6):1417-1431

المؤلفون: Choi, Su-Min, Jo, Hyeon-Bhin, Yun, Do-Young, Kim, Jun-Gyu, Park, Wan-Soo, Baek, Ji-Min, Lee, In-Geun, Shin, Jang-Kyoo, Kwon, Hyuk-Min, Tsutsumi, Takuya, Sugiyama, Hiroki, Matsuzaki, Hideaki, Lee, Jae-Hak, Kim, Dae-Hyun

المصدر: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :8.3.1-8.3.4 Dec, 2022

Relation: 2022 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Shin, Hakjong, Lee, Sang-yeon, Kim, Jun-gyu, Park, Dae-Heon, Jo, Seng-Kyoun, Kwak, Younghoon

المصدر: In Case Studies in Thermal Engineering May 2024 57

المؤلفون: Lee, Sang-Yeon^Aff4, Lee, In-Bok^Aff4, Kim, Jun-gyu^Aff4

المساهمون: Berckmans, Daniel, Series Editor^Aff1, Norton, Tomas, Series Editor^Aff2, Bartzanas, Thomas, editor^Aff3

المصدر: Technology for Environmentally Friendly Livestock Production. :251-278

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المؤلفون: Kim, Jun-gyu, Lee, In-bok, Jeong, Deuk-young, Park, Se-jun, Cho, Jeong-hwa, Kim, Rack-woo

المصدر: In Biosystems Engineering June 2023 230:83-105

المؤلفون: Kim, Jun-gyu, Lee, In-bok, Aarnink, Andre, Lee, Bong-joo, Jeong, Deuk-young, Jeong, Hyo-hyeog, Kim, Se-han, Lee, Bong-kuk, Lee, Dong-kyu

المصدر: In Biosystems Engineering June 2023 230:106-130

المؤلفون: Jo, Hyeon-Bhin, Yun, Seung-Won, Kim, Jun-Gyu, Yun, Do-Young, Lee, In-Geun, Kim, Dae-Hyun, Kim, Tae-Woo, Kim, Sang-Kuk, Yun, Jacob, Kim, Ted, Tsutsumi, Takuya, Sugiyama, Hiroki, Matsuzaki, Hideaki

المصدر: 2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :8.4.1-8.4.4 Dec, 2020

Relation: 2020 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Yeo, Uk-Hyeon, Lee, Sang-Yeon, Park, Se-Jun, Kim, Jun-Gyu, Jeong, Deuk-Young, Decano-Valentin, Cristina S., Kim, Rack-Woo, Lee, In-Bok

المصدر: In Biosystems Engineering May 2023 229:1-17