المؤلفون: Ahn, Klaus, Park, Jade, Lee, Bruce, Kang, Lewis, Kim, Jay, Shin, Kyeongrok, Kim, Sung Hyuk, Lee, Jea-Duck, Kim, Myoung Kee, Lee, Ho-Seon, Park, Byeong-Gyu, Park, Bok-Ju, Kong, Tong-Ook

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1384-1389 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Kim Dong Hyeon, Lee Chanwoo, Kim Sung Hyuk, Jeong Byeong Geun, Yun Seok Joon, Suh Hyeong Chan, Lee Dongki, Kim Ki Kang, Jeong Mun Seok

المصدر: Nanophotonics, Vol 13, Iss 7, Pp 1069-1077 (2024)

مصطلحات موضوعية: tip-enhanced raman spectroscopy (ters), molybdenum disulfide (mos2), tungsten disulfide (ws2), multi-disorder, nanoscale alloy, Physics, QC1-999

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2192-8614

URL الوصول: https://doaj.org/article/a5b76ab222104174adcf7fa77b0024dd

المؤلفون: Lee, Chanwoo, Jeong, Byeong Geun^{Aff1, Aff2}, Kim, Sung Hyuk^{Aff1, Aff2}, Kim, Dong Hyeon^{Aff1, Aff2}, Yun, Seok Joon^{Aff1, Aff3}, Choi, Wooseon, An, Sung-Jin, Lee, Dongki, Kim, Young-Min^{Aff1, Aff3}, Kim, Ki Kang^{Aff1, Aff3}, Lee, Seung Mi^{Aff5, IDs41699022003344_cor11}, Jeong, Mun Seok^{Aff2, Aff6, IDs41699022003344_cor12}

المصدر: npj 2D Materials and Applications. 6(1)

المؤلفون: Kim, Sung-Hyuk, Park, Jong-Jin, Kim, Jae-Myeong, Yoo, Sehoon, Park, Young-Bae

المصدر: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :719-722 Dec, 2012

Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

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المؤلفون: Kim, Dong Hyeon, Lee, Chanwoo, Kim, Sung Hyuk, Jeong, Byeong Geun, Yun, Seok Joon, Suh, Hyeong Chan, Lee, Dongki, Kim, Ki Kang, Jeong, Mun Seok

المصدر: Nanophotonics (21928606); Mar2024, Vol. 13 Issue 7, p1069-1077, 9p

مصطلحات موضوعية: HETEROJUNCTIONS, ELECTRONIC band structure, TRANSITION metals, RAMAN spectroscopy, CHARGE transfer

المؤلفون: Kwak, Byung-Hyun, Kim, Sung-Hyuk, Park, Young-Bae

المصدر: 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. :1-2 Jan, 2012

Relation: 2011 IEEE International 3D Systems Integration Conference (3DIC)

المؤلفون: Kim, Hyojung, Byun, Hye Ryung, Kim, Bora, Kim, Sung Hyuk, Oh, Hye Min, Jeong, Mun Seok^Aff1

المصدر: Journal of the Korean Physical Society. 73(11):1675-1678

المؤلفون: Kim, Hyojung, Byun, Hye Ryung, Kim, Bora, Kim, Sung Hyuk, Oh, Hye Min, Jeong, Mun Seok^Aff1

المصدر: Journal of the Korean Physical Society. 78(11):1162-1162

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