يعرض 1 - 10 نتائج من 480 نتيجة بحث عن '"Kim, Young Soon"', وقت الاستعلام: 1.05s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Potential role of ice-binding protein in mitochondria-lipid and ATP mechanisms during freezing of plant callus

    المؤلفون: Kim, Euihyun, Kwon, Gi-Sok, Choi, Sunmee, Kim, Soo-Yun, Heo, Kyeong Yeon, Kim, Young Soon, Kim, Cha Young, Kim, Soyoung, Jeong, Jae Cheol, Hwang, Jisub, Lee, Jun Hyuck, Lee, Jeong Hun, Moh, Sang Hyun

    المصدر: In Plant Physiology and Biochemistry September 2024 214

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  2. 2
    مؤتمر
    A Study on the Double Layer Non Conductive Films (NCFs) for Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection

    المؤلفون: Lee, SeYong, Shin, Ji-Won, Lee, Hyeong Gi, Kim, Young Soon, Paik, Kyung-Wook

    المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :917-922 May, 2016

    Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

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  3. 3
    دورية أكاديمية

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  4. 4
    دورية أكاديمية

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  5. 5
    مؤتمر
    A novel fine pitch TSV interconnection method using NCF with Zn nano-particles

    المؤلفون: Shin, Ji-Won, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Seo, Sun Kyung, Paik, Kyung-Wook

    المصدر: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :1128-1133 May, 2014

    Relation: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    A study on the fine pitch chip interconnection using Cu/SnAg bumps and B-stage non-conductive films (NCFs) for 3D-TSV vertical interconnection

    المؤلفون: Choi, Yongwon, Shin, Jiwon, Kim, Young Soon, Suk, Kyung-lim, Kim, Il, Paik, Kyung-Wook

    المصدر: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :1661-1666 May, 2014

    Relation: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    A novel double layer NCF for highly reliable micro-bump interconnection

    المؤلفون: Shin, Ji-Won, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Seo, Sun Kyung, Paik, Kyung-Wook

    المصدر: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :1755-1758 May, 2014

    Relation: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    Effect of NCFs with Zn-nanoparticles on the interfacial reactions of 40 um pitch Cu pillar/Sn-Ag bump for TSV interconnection

    المؤلفون: Shin, Ji-Won, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Jee, Young Kun, Paik, Kyung-Wook

    المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :1024-1030 May, 2013

    Relation: 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    Development of anhydride-based NCFs for Cu/Sn-Ag eutectic bonding and process optimization for fine pitch TSV chip stacking

    المؤلفون: Shin, Ji-Won, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Jee, Young Kun, Hwang, Ji Hwan, Paik, Kyung-Wook

    المصدر: 2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :31-35 May, 2012

    Relation: 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

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  10. 10
    دورية أكاديمية

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