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المؤلفون: Rojhat Baba, Kim Hoey Yeoh, Vinith Bejugam, Robert Thalmann, Matthias Fettke, Georg Friedrich, Timo Kubsch, Thorsten Teutsch
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Interconnection, Materials science, Scanning electron microscope, Soldering, Polishing, Electroless nickel immersion gold, Substrate (electronics), Composite material, Focused ion beam, Layer (electronics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::14a735e6efbc704fa6c50bd3aefa4d5d
https://doi.org/10.1109/ectc32696.2021.00084 -
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المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
مصطلحات موضوعية: Resist, Computer science, law, Soldering, Electronic packaging, Mechanical engineering, Photolithography, Electroplating, Lithography, Wafer-level packaging, Die (integrated circuit), law.invention
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ec25057c8415c74259effeb9f37da279
https://doi.org/10.1109/eptc47984.2019.9026688