المؤلفون: Qureshi, H.A., Oh, S., Khan, N., Kim, Y.H., Nallanathan, A.

المصدر: IEEE Wireless Communications Letters IEEE Wireless Commun. Lett. Wireless Communications Letters, IEEE. 13(8):2085-2089 Aug, 2024

المؤلفون: Cantos, L., Choi, J., Kim, Y.H.

المصدر: IEEE Transactions on Wireless Communications IEEE Trans. Wireless Commun. Wireless Communications, IEEE Transactions on. 23(6):5740-5755 Jun, 2024

المؤلفون: Houdouin-Quenault M., Sage C., Méplan O., Ramdhane M., Dauvergne D., Gallin-Martel M.L., Muraz J.F., Guillaudin O., Marcatili S., Kessedjian G., Chebboubi A., Serot O., Litaize O., Bernard D., Köster U., Kim Y.H., Mutti P., Smith A.G.

المصدر: EPJ Web of Conferences, Vol 284, p 04003 (2023)

مصطلحات موضوعية: Physics, QC1-999

وصف الملف: electronic resource

Relation: https://www.epj-conferences.org/articles/epjconf/pdf/2023/10/epjconf_nd2023_04003.pdf; https://doaj.org/toc/2100-014X

URL الوصول: https://doaj.org/article/66254f7324ed459d967050feba2f0aa8

المؤلفون: Awais, M., Khan, M.A., Kim, Y.H.

المصدر: IEEE Wireless Communications Letters IEEE Wireless Commun. Lett. Wireless Communications Letters, IEEE. 12(10):1726-1730 Oct, 2023

المؤلفون: Le, T.H.T., Cantos, L., Pandey, S.R., Shin, H., Kim, Y.H.

المصدر: IEEE Transactions on Vehicular Technology IEEE Trans. Veh. Technol. Vehicular Technology, IEEE Transactions on. 72(9):11558-11574 Sep, 2023

المؤلفون: Lim, H.S.^{Aff1, Aff4}, Chung, J. S., Jo, H.S.^{Aff1, IDs10909024031911_cor3}, Kim, H.B.^{Aff3, Aff4, IDs10909024031911_cor4}, Kim, H. L., Kim, Y.H.^{Aff2, Aff4}, Kim, W. T.^{Aff2, Aff4}, Kwon, D. H.^{Aff2, Aff4}, Lee, D. Y., Lee, Y. C.^{Aff3, Aff4}, Woo, K.R.^{Aff2, Aff4, IDs10909024031911_cor11}

المصدر: Journal of Low Temperature Physics. :1-9

المؤلفون: Kim, Y.H., Kim, M.K., Suhr, J., Lee, T.^{Aff2, IDs11340024010893_cor4}, Kim, M.K.^{Aff1, Aff3, IDs11340024010893_cor5}

المصدر: Experimental Mechanics: An International Journal Integrating Experimental Methods with the Mechanical Behavior of Materials and Structures. :1-10

المؤلفون: Kim, M.B., Chung, J.S., Jeon, J.A., Kang, C.S., Kim, H.B., Kim, H.L., Kim, S.C., Kim, S.G., Kim, S.R., Kim, W.T., Kim, Y.H., Kwon, D.H., Lee, D.Y., Lee, H.J., Lee, M.K., Lee, S.H., Lee, Y.C., Lim, H.S., Woo, K.R.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 33(5):1-5 Aug, 2023

المؤلفون: Mailyan, B., Sharma, B., Kim, H.J., Kim, S.C., Kim, W.T., Kim, Y.D., Kim, Y.H., Lee, M.H., Woo, K.R.

المصدر: IEEE Transactions on Nuclear Science IEEE Trans. Nucl. Sci. Nuclear Science, IEEE Transactions on. 70(7):1307-1311 Jul, 2023

المؤلفون: Chang S.Y., Cheon Y.W., Yoon Y.H., Kim Y.H., Kim J.Y., Lee Y.K., Lee W.H.

المصدر: Archives of Metallurgy and Materials, Vol 62, Iss 2, Pp 1299-1302 (2017)

مصطلحات موضوعية: Sintering, Mechanical alloying, Powder consolidation, Intermetallic compounds, Titanium silicide, Mining engineering. Metallurgy, TN1-997, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: http://www.degruyter.com/view/j/amm.2017.62.issue-2/amm-2017-0196/amm-2017-0196.xml?format=INT; https://doaj.org/toc/2300-1909

URL الوصول: https://doaj.org/article/bd32a9da931347dca72492a73de991d1