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المؤلفون: Dong Chen, Chiming Lai, Jintang Shang, Li Zhang, Yu Zou, Ching-Ping Wong, Kim-Hui Chen, Yu Ji
المصدر: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, Silicon, business.industry, Bubble, chemistry.chemical_element, Substrate (electronics), Semiconductor device, Wafer backgrinding, law.invention, Die preparation, chemistry, law, Optoelectronics, Wafer, business, Light-emitting diode
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::68599448d6bfa6f4f80d955eaa62ae3f
https://doi.org/10.1109/ectc.2014.6897626 -
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المؤلفون: Ji Yu, Dong Chen, Chiming Lai, Jintang Shang, Kim-Hui Chen, Li Zhang, Yu Zou
المصدر: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
مصطلحات موضوعية: Microelectromechanical systems, Fabrication, Materials science, Silicon, business.industry, chemistry.chemical_element, Substrate (electronics), law.invention, chemistry, law, Surface roughness, Optoelectronics, Wafer, business, Wafer-level packaging, Light-emitting diode
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::02030b8ee8fe9734b4c9dc7f547372fa
https://doi.org/10.1109/eptc.2013.6745850 -
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المؤلفون: Yu Ji, Kim-Hui Chen, Jintang Shang, Chiming Lai, Dong Chen, Yu Zou, Li Zhang
المصدر: 2013 14th International Conference on Electronic Packaging Technology.
مصطلحات موضوعية: Microelectromechanical systems, Surface micromachining, Materials science, Volume (thermodynamics), Atomic force microscopy, Scientific method, Nanotechnology, Wafer, Foaming agent, Composite material, Wafer-level packaging
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::396b7f9ec9a2611545d1085ec962289f
https://doi.org/10.1109/icept.2013.6756565