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1دورية أكاديمية
المؤلفون: Xingchao Mao, Yuxuan An, Yang Chen, Gong Zheng, Rui Hou, Xinyu Zhang, Yuzheng Guo, Sheng Liu, King-Ning Tu, Yingxia Liu
المصدر: Journal of Materials Research and Technology, Vol 30, Iss , Pp 1136-1147 (2024)
مصطلحات موضوعية: 3D IC, Low melting point solder, Solder joint, Microbump, Nano-mechanical property, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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2دورية أكاديمية
المؤلفون: Mingkun Yang, Xiuchen Zhao, Yongjun Huo, King-Ning Tu, Yingxia Liu
المصدر: Journal of Materials Research and Technology, Vol 24, Iss , Pp 71-80 (2023)
مصطلحات موضوعية: Microstructural evolution, Solder joint, Contact angle, Intermetallic compounds (IMCs), Fracture, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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3دورية أكاديمية
المؤلفون: Po-Ning Hsu, Kai-Cheng Shie, Kuan-Peng Chen, Jing-Chen Tu, Cheng-Che Wu, Nien-Ti Tsou, Yu-Chieh Lo, Nan-Yow Chen, Yong-Fen Hsieh, Mia Wu, Chih Chen, King-Ning Tu
المصدر: Scientific Reports, Vol 12, Iss 1, Pp 1-7 (2022)
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2045-2322
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4دورية أكاديمية
المؤلفون: Wei-You Hsu, Shih-Chi Yang, You-Yi Lin, Wan-Zhen Hsieh, King-Ning Tu, Wei-Lan Chiu, Hsiang-Hung Chang, Ching-Yu Chiang, Chih Chen
المصدر: Nanomaterials, Vol 13, Iss 17, p 2448 (2023)
مصطلحات موضوعية: synchrotron radiation, X-ray nanodiffraction, thermal strain distribution, Cu/SiO2 hybrid bonding, nanotwinned Cu, Chemistry, QD1-999
وصف الملف: electronic resource
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5مؤتمر
المؤلفون: Han-wen Lin, Jia-ling Lu, Chen-min Liu, Chih Chen, King-ning Tu, Delphic Chen, Jui-Chao Kuo
المصدر: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International. :90-93 Oct, 2012
Relation: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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6مؤتمر
المؤلفون: Kyuchul Chong, Xi Zhang, King-Ning Tu, Daquan Huang, Mau-Chung Frank Chang, Ya-Hong Xie
المصدر: Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005. Custom Integrated Circuits Custom Integrated Circuits Conference, 2005. Proceedings of the IEEE 2005. :663-666 2005
Relation: Proceedings of the IEEE 2005 Custom Integrated Circuits Conference
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7مؤتمر
المؤلفون: Xi Zhang, Kyuchul Chong, Ya-Hong Xie, King-Ning Tu
المصدر: Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on. :187-192 2005
Relation: 2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
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8مؤتمر
المؤلفون: Lee, T.-Y.T., Taek Yeong Lee, King-Ning Tu
المصدر: 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Electronic components and technology Electronic Components and Technology Conference, 2001. Proceedings., 51st. :558-563 2001
Relation: 51st Electronic Components and Technology Conference 2001. Proceedings
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9مؤتمر
المؤلفون: Minyu Yan, Jong-ook Suh, King Ning Tu, Vairagar, A.V., Mhaisalkar, S.G., Krishnamoorthy, A.
المصدر: Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on. :153-155 2005
Relation: 2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
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10دورية أكاديمية
المؤلفون: Kyuchul Chong, Xi Zhang, King-Ning Tu, Daquan Huang, Mau-Chung Chang, Ya-Hong Xie
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 52(11):2440-2446 Nov, 2005