المؤلفون: Xingchao Mao, Yuxuan An, Yang Chen, Gong Zheng, Rui Hou, Xinyu Zhang, Yuzheng Guo, Sheng Liu, King-Ning Tu, Yingxia Liu

المصدر: Journal of Materials Research and Technology, Vol 30, Iss , Pp 1136-1147 (2024)

مصطلحات موضوعية: 3D IC, Low melting point solder, Solder joint, Microbump, Nano-mechanical property, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785424006756; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/6ea9871ac1d24dda8666d4f3e8c3f453

المؤلفون: Mingkun Yang, Xiuchen Zhao, Yongjun Huo, King-Ning Tu, Yingxia Liu

المصدر: Journal of Materials Research and Technology, Vol 24, Iss , Pp 71-80 (2023)

مصطلحات موضوعية: Microstructural evolution, Solder joint, Contact angle, Intermetallic compounds (IMCs), Fracture, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423004593; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/e8716004f0c34988951e7d1fc7b924b0

المؤلفون: Po-Ning Hsu, Kai-Cheng Shie, Kuan-Peng Chen, Jing-Chen Tu, Cheng-Che Wu, Nien-Ti Tsou, Yu-Chieh Lo, Nan-Yow Chen, Yong-Fen Hsieh, Mia Wu, Chih Chen, King-Ning Tu

المصدر: Scientific Reports, Vol 12, Iss 1, Pp 1-7 (2022)

مصطلحات موضوعية: Medicine, Science

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2045-2322

URL الوصول: https://doaj.org/article/023357c61b2646efba302f77f2a40330

المؤلفون: Wei-You Hsu, Shih-Chi Yang, You-Yi Lin, Wan-Zhen Hsieh, King-Ning Tu, Wei-Lan Chiu, Hsiang-Hung Chang, Ching-Yu Chiang, Chih Chen

المصدر: Nanomaterials, Vol 13, Iss 17, p 2448 (2023)

مصطلحات موضوعية: synchrotron radiation, X-ray nanodiffraction, thermal strain distribution, Cu/SiO2 hybrid bonding, nanotwinned Cu, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2079-4991/13/17/2448; https://doaj.org/toc/2079-4991

URL الوصول: https://doaj.org/article/29123c55454c49d8833f2e1aa2e5d138

المؤلفون: Han-wen Lin, Jia-ling Lu, Chen-min Liu, Chih Chen, King-ning Tu, Delphic Chen, Jui-Chao Kuo

المصدر: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International. :90-93 Oct, 2012

Relation: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Kyuchul Chong, Xi Zhang, King-Ning Tu, Daquan Huang, Mau-Chung Frank Chang, Ya-Hong Xie

المصدر: Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005. Custom Integrated Circuits Custom Integrated Circuits Conference, 2005. Proceedings of the IEEE 2005. :663-666 2005

Relation: Proceedings of the IEEE 2005 Custom Integrated Circuits Conference

المؤلفون: Xi Zhang, Kyuchul Chong, Ya-Hong Xie, King-Ning Tu

المصدر: Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on. :187-192 2005

Relation: 2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

المؤلفون: Lee, T.-Y.T., Taek Yeong Lee, King-Ning Tu

المصدر: 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Electronic components and technology Electronic Components and Technology Conference, 2001. Proceedings., 51st. :558-563 2001

Relation: 51st Electronic Components and Technology Conference 2001. Proceedings

المؤلفون: Minyu Yan, Jong-ook Suh, King Ning Tu, Vairagar, A.V., Mhaisalkar, S.G., Krishnamoorthy, A.

المصدر: Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on. :153-155 2005

Relation: 2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

المؤلفون: Kyuchul Chong, Xi Zhang, King-Ning Tu, Daquan Huang, Mau-Chung Chang, Ya-Hong Xie

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 52(11):2440-2446 Nov, 2005