المؤلفون: Wang, C., Chiu, P., Ko, C., Tseng, S., Li, C.

المصدر: IEEE Journal on Emerging and Selected Topics in Circuits and Systems IEEE J. Emerg. Sel. Topics Circuits Syst. Emerging and Selected Topics in Circuits and Systems, IEEE Journal on. 14(1):52-66 Mar, 2024

المؤلفون: Shih, M. L., Shih, P. S., Huang, J. H., Chen, I. A., Wang, J. S., Ko, C. T., Lin, B. R., Yang, K. M., Lin, C. H., Lee, A. S., Kao, C. R.

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :1-2 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Lau, J.H., Lin, C., Liu, H., Yang, K., Xia, T., Ko, C., Lin, B.P., Chuang, Y., Chen, R., Ma, M., Tseng, T., Li, M., Leung, K.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(9):1371-1379 Sep, 2023

المؤلفون: Wu, T., Lian, C., Lee, S., Pastewait, M., Piers, C., Liu, J., Wang, F., Wang, L., Chiu, C., Wang, W., Jackson, C., Chao, W., Shen, D., Ko, C.

المصدر: IEEE Transactions on Medical Imaging IEEE Trans. Med. Imaging Medical Imaging, IEEE Transactions on. 41(11):3158-3166 Nov, 2022

المؤلفون: Ko, C., Lin, C., Chen, Y., Wang, C.

المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 41(3):642-655 Mar, 2022

المؤلفون: Peng, T.C., Lau, J.H., Ko, C., Lee, P., Lin, E., Yang, K., Lin, B.P., Xia, T., Chang, L., Liu, H., Lin, C., Lee, T.N., Wong, J., Ma, M., Tseng, T.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(3):469-478 Mar, 2022

المؤلفون: Ko, C., Wu, S.

المصدر: IEEE Transactions on Mobile Computing IEEE Trans. on Mobile Comput. Mobile Computing, IEEE Transactions on. 21(1):1-15 Jan, 2022

المؤلفون: Lau, J. H., Chen, G., Yang, C., Peng, A., Huang, J., Peng, C., Ko, C., Yang, H., Chen, Y., Tseng, T.

المصدر: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :3.5.1-3.5.4 Dec, 2022

Relation: 2022 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Lau, J.H., Ko, C., Lin, C., Tseng, T., Yang, K., Xia, T., Lin, P.B., Peng, C., Lin, E., Chang, L., Liu, N., Chiu, S.M., Lee, T.N.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(5):739-747 May, 2021

المؤلفون: Lau, J.H., Ko, C.-T., Yang, K.-M., Peng, C.-Y., Xia, T., Lin, P.B., Chen, J.J., Huang, P.-C., Liu, H.N., Tseng, T.-J.

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :339-347 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)