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1دورية أكاديمية
المصدر: IEEE Transactions on Biomedical Circuits and Systems IEEE Trans. Biomed. Circuits Syst. Biomedical Circuits and Systems, IEEE Transactions on. 18(3):702-713 Jun, 2024
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2دورية أكاديمية
المصدر: IEEE Transactions on Terahertz Science and Technology IEEE Trans. THz Sci. Technol. Terahertz Science and Technology, IEEE Transactions on. 13(6):671-677 Nov, 2023
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3دورية أكاديمية
المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 23(21):26055-26066 Nov, 2023
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4دورية أكاديمية
المصدر: IEEE Transactions on Network Science and Engineering IEEE Trans. Netw. Sci. Eng. Network Science and Engineering, IEEE Transactions on. 10(4):2030-2044 Aug, 2023
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5دورية أكاديمية
المؤلفون: Thibord, F, Klarin, D, Brody, JA, Chen, MH, Levin, MG, Chasman, DI, Goode, EL, Hveem, K, Teder-Laving, M, Martinez-Perez, A, Aissi, D, Daian-Bacq, D, Ito, K, Natarajan, P, Lutsey, PL, Nadkarni, GN, de Vries, PS, Cuellar-Partida, G, Wolford, BN, Pattee, JW, Kooperberg, C, Braekkan, SK, Li-Gao, RF, Saut, N, Sept, C, Germain, M, Judy, RL, Wiggins, KL, Ko, D, O'Donnell, CJ, Taylor, KD, Giulianini, F, De Andrade, M, Nost, TH, Boland, A, Empana, JP, Koyama, S, Gilliland, T, Do, R, Huffman, JE, Wang, X, Zhou, W, Soria, JM, Souto, JC, Pankratz, N, Haessler, J, Hindberg, K, Rosendaal, FR, Turman, C, Olaso, R, Kember, RL, Bartz, TM, Lynch, JA, Heckbert, SR, Armasu, SM, Brumpton, B, Smadja, DM, Jouven, X, Komuro, I, Clapham, KR, Loos, RJF, Willer, CJ, Sabater-Lleal, M, Pankow, JS, Reiner, AP, Morelli, VM, Ridker, PM, Vlieg, AV, Deleuze, JF, Kraft, P, Rader, DJ, Lee, KM, Psaty, BM, Skogholt, AH, Emmerich, J, Suchon, P, Rich, SS, Vy, HT, Tang, WH, Jackson, RD, Hansen, JB, Morange, PE, Kabrhel, C, Tregouet, DA, Damrauer, SM, Johnson, AD, Smith, NL
المصدر: Circulation. 146(16):1225-1242
مصطلحات موضوعية: Medicin och hälsovetenskap
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6دورية أكاديمية
المصدر: IEEE Access Access, IEEE. 11:14524-14532 2023
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7دورية أكاديمية
المؤلفون: Kwon, D., Lee, S., Kim, K., Oh, S., Park, J., Hong, G., Ka, D., Hwang, K., Kang, K., Kim, J., Jeon, J., Kim, N., Kwon, Y., Kornijcuk, V., Shin, W., Won, J., Lee, M., Joo, H., Choi, H., Kim, G., An, B., Lee, J., Ko, D., Jun, Y., Kim, I., Song, C., Park, C., Kim, S., Jeong, C., Lim, E., Kim, D., Jang, J., Park, I., Chun, J., Cho, J.
المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 58(1):291-302 Jan, 2023
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8مؤتمرLg = 60 nm In0.53 Ga0.47 As MBCFETs: From gm_max = 13.7 mS/üm and Q = 180 to virtual-source modeling
المؤلفون: Yoo, J.-H., Jo, H.-B., Lee, I.-G., Choi, S.-M., Baek, J.-M., Lee, S T., Jang, H., Kong, M W., Kim, H H., Lee, H J., Kim, H.-J., Jeong, H.-S., Park, W.-S., Ko, D H., Shin, S. H., Kwon, H.-M., Kim, S K., Kim, J G., Yun, J., Kim, T., Shin, K.-Y., Kim, T.-W., Shin, J.-K., Lee, J.-H., Shin, C.-S., Seo, K.-S., Kim, D.-H.
المصدر: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023
Relation: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
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9دورية أكاديمية
المؤلفون: Lee, D., Ko, D., Chung, W.K., Kim, K.
المصدر: IEEE/ASME Transactions on Mechatronics IEEE/ASME Trans. Mechatron. Mechatronics, IEEE/ASME Transactions on. 27(4):1937-1945 Aug, 2022
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10دورية أكاديمية
المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 22(6):5238-5247 Mar, 2022