المؤلفون: Koh, Meiten, Kawata, Yuna, Yoneda, Kazuyoshi, Nakada, Kazutaka, Naka, Yusuke, Uchida, Mitsuya

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1370-1375 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Wang, Terry, Lu, Chih Wei, Feng, Eric, Yang, Yu-Jhen, Chang, Cheng-Yueh, Cheng, Pei-Pei, Lie, Fredrick, Cheng, Austin, Huang, Hsin-Yi, Koh, Meiten, Wiatrowska, Aneta, Witczak, Lukasz

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1868-1871 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Koh, Meiten, Yoneda, Kazuyoshi, Nakada, Kazutaka, Aoyama, Yoshitomo, Hashimoto, Kasumi, Oki, Kota, Naka, Kensuke, Kawata, Yuna

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1254-1259 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Morikawa, Yasuhiro, Koh, Meiten, Hashimoto, Hiroyuki, Chen, Chuantong, Wang, Ye, Kono, Ichiro, Wakisaka, Shinji, Ukawa, Ken, Fukushima, Takafumi, Suganuma, Katsuaki, Kurita, Yoichiro

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :34-39 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Koh, Meiten, Yoneda, Kazuyoshi, Kazutaka, Nakada, Kawata, Yuna, Naka, Kensuke

المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :219-220 Apr, 2023

Relation: 2023 International Conference on Electronics Packaging (ICEP)

المؤلفون: Kakutani, Takenori, Suzuki, Yuya, Koh, Meiten, Sekiguchi, Shoya, Matsumura, Satoko, Oki, Kota, Mishima, Shoko, Ishikawa, Nobuhiro, Ogata, Toshiyuki, Erdogan, Serhat, Ali, Muhammad, Kathaperumal, Mohanalingam, Swaminathan, Madhavan

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :538-543 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Koh, Meiten, Yoneda, Kazuyoshi, Nakada, Kazutaka, Sekiguchi, Shoya, Mishima, Shoko, Ishikawa, Nobuhiro, Ogata, Toshiyuki

المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :63-64 May, 2022

Relation: 2022 International Conference on Electronics Packaging (ICEP)

المؤلفون: Koh, Meiten, Shimura, Masayuki, Sekiguchi, Shoya, Mishima, Shoko, Ishikawa, Nobuhiro, Ogata, Toshiyuki

المصدر: 2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :129-130 May, 2021

Relation: 2021 International Conference on Electronics Packaging (ICEP)

المؤلفون: Ogata, Ken, Jeon, Seongho, Ko, Dong-Su, Jung, Insun, Kim, Jinhae, Ito, Kimihiko, Kubo, Yoshimi, Takei, Koichi, Saito, Shunsuke, Cho, Yonghee, Park, Hosang, Jang, Jihyun, Kim, Heegoo, Kim, Jung-Hwa, Kim, Yongsu, Koh, Meiten, Uosaki, Kohei, Doo, Seok-Gwang, Hwang, Yunil, Han, Sung-soo

مصطلحات موضوعية: Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/1706.00169

المؤلفون: Kang, Yoon-Sok, Park, Seong Yong, Ito, Kimihiko, Kubo, Yoshimi, Shin, Yongwoo, Kim, Dong Young, Seo, Dong-Hwa, Kim, Soojin, Park, Jin-Hwan, Doo, Seok-Gwang, Koh, Meiten, Seo, Jin Ah, Park, Kwangjin

المصدر: In Journal of Power Sources 1 April 2021 490